209715 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors Function
Sub-classes:SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT DEVICE, AND METHOD
#2Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips
#3Semiconductor packages
#4Semiconductor packages including stacked substrates and penetration electrodes
#5Integrated circuit (IC) package with substrate having validation connectors
#6Semiconductor device
#7Semiconductor device
#8Semiconductor devices including unitary supports
#9Surface mountable electronic component