H01L2224/241 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; High density interconnect [HDI] connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector Disposition

• H01L2224/24101 » Connecting bonding areas at the same height 164
• H01L2224/24105 » Connecting bonding areas at different heights 151
• H01L2224/2413 » Connecting within a semiconductor or solid-state body 16
• H01L2224/24135 » Connecting between different semiconductor or solid-state bodies i.e. chip-to-chip 7
• H01L2224/24151 » Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive 3

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