209778 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; High density interconnect [HDI] connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector; Disposition Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
#2SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#3Substrate comprising a high-density interconnect portion embedded in a core layer
#4System-level packaging structures
#5Local dense patch for board assembly utilizing laser structuring metallization process