209795 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; High density interconnect [HDI] connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors Material
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
#2HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
#3HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
#4HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
#5PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#6High density substrate routing in package
#7Package structure comprising thermally conductive layer around the IC die
#8High density substrate routing in package
#9High density substrate routing in package
#10High density substrate routing in package
#11High density substrate routing in package
#12High density substrate routing in package
#13High density substrate routing in BBUL package
#14High density substrate routing in BBUL package
#15High density substrate routing in BBUL package