209784 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; High density interconnect [HDI] connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
Sub-classes:Stacked chip package and methods of manufacture thereof
#2Semiconductor device and method for manufacturing the same
#3Stacked chip package and methods of manufacture thereof
#4Structure and formation method for chip package
#5Serially interconnected vertical-cavity surface emitting laser arrays