209798 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Auxiliary members for layer connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
Sub-classes:POWER MODULE
#2ELECTRONIC MODULE
#3SEMICONDUCTOR DEVICE
#4SEMICONDUCTOR PACKAGE
#5CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME, AND POWER MODULE HAVING SAME
#6SEMICONDUCTOR PACKAGE
#7MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL
#8DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
#9Display panel, preparation method thereof, and display device
#10METHOD FOR FABRICATING AN ELECTRONIC DEVICE
#11PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE
#12Die with metallized sidewall and method of manufacturing
#13Backside spacer structures for improved thermal performance
#14Stack of integrated-circuit chips and electronic device
#15METHOD FOR MOUNTING SEMICONDUCTOR SENSOR DEVICE
#16Escape routes
#17Semiconductor package and method of manufacturing the same
#18Semiconductor device and method for manufacturing the same
#19SENSOR APPARATUS AND METHOD FOR MOUNTING SEMICONDUCTOR SENSOR DEVICE
#20ELECTRONIC CHIP AND SUBSTRATE PROVIDING INSULATION PROTECTION BETWEEN CONDUCTING NODES
#21MULTI CHIP STACKING WITH RELIABLE JOINING