209797 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto Auxiliary members for layer connectors, e.g. spacers
Sub-classes:CORNER STRESS REDUCTION IN SEMICONDUCTOR ASSEMBLIES
#2SEMICONDUCTOR DEVICE
#3ELECTRONIC MODULE
#4PUMP-OUT RESISTANT COLDPLATE
#5POWER MODULE
#6SEMICONDUCTOR DEVICE
#7SEMICONDUCTOR DEVICE
#8Adhesive member, display device, and manufacturing method of display device
#9POWER SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR MODULE
#10DOUBLE-SIDE COOLING-TYPE SEMICONDUCTOR DEVICE
#11Adhesive member, display device, and manufacturing method of display device
#12Power module
#13Soldering structure with groove portion and power module comprising the same
#14METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON FORMATION OF INTER-DIFFUSION LAYERS
#15Power electronics module
#16Adhesive for semiconductor mounting, and semiconductor sensor
#17Adhesive for semiconductor sensor chip mounting, and semiconductor sensor
#18Method and apparatus for creating a bond between objects based on formation of inter-diffusion layers
#19Anisotropic conductive film and production method of the same
#20Semiconductor device with reduced thickness
#21Semiconductor package
#22Solder, solder joint structure and method of forming solder joint structure
#23Component and method of manufacturing a component using an ultrathin carrier
#24Organic lighting device and lighting equipment
#25Semiconductor device
#26Semiconductor device
#27Chip arrangement and method for producing a chip arrangement
#28Power module, method for manufacturing power module, and molding die
#29Semiconductor package having supporting plate and method of forming the same
#30METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#31High temperature gold-free wafer bonding for light emitting diodes
#32Substrate for integrated modules
#33Semiconductor device
#34SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#35SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#36PACKAGED DEVICE INCLUDING INTERPOSER FOR INCREASED ADHESIVE THICKNESS AND METHOD OF ATTACHING DIE TO SUBSTRATE
#37MEMS anchor and spacer structure
#38Semiconductor device
#39Semiconductor device and method of manufacturing the same
#40Repairing defects in a nonvolatile semiconductor memory module utilizing a heating element
#41Semiconductor apparatus and method for manufacturing the same
#42DIE-BONDING FILM AND USE THEREOF
#43Semiconductor device adapted to improve heat dissipation
#44Mosfet package
#45SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#46Power semiconductor package structure and manufacturing method thereof
#47Semiconductor device
#48THERMOSETTING DIE-BONDING FILM
#49Metal substrate and light source device
#50Thermosetting die-bonding film
#51Semiconductor packages and methods for producing the same
#52Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer
#53Device with semiconductor die attached to a leadframe
#54Circuit device having an improved heat dissipitation, and the method of manufacturing the same
#55Semiconductor device production method and semiconductor device
#56Stitch bump stacking design for overall package size reduction for multiple stack
#57Method of assembling shielded integrated circuit device
#58System and method for multi-chip module die extraction and replacement
#59SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTERED BOND
#60Composite component and method for producing a composite component
#61SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#62Method for manufacturing a semiconductor device using an Al-Zn connecting material
#63Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chip
#64SEMICONDUCTOR MODULE WITH COOLING MECHANISM AND PRODUCTION METHOD THEREOF
#65SEMICONDUCTOR MODULE WITH RESIN-MOLDED PACKAGE OF HEAT SPREADER AND POWER SEMICONDUCTOR CHIP
#66Forming a semiconductor package including a thermal interface material
#67Semiconductor device
#68Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material
#69Semiconductor unit having a power semiconductor and semiconductor apparatus using the same
#70Method for fixing a photovoltaic cell connector on a surface of a photovoltaic cell, photovoltaic cell connector forming die, device for fixing a photovoltaic cell connector on a surface of a photovoltaic cell
#71Method of manufacturing semiconductor apparatus
#72Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof
#73Power semiconductor module
#74Nanotube Materials for Thermal Management of Electronic Components
#75DOUBLE-FACED ADHESIVE FILM AND ELECTRONIC COMPONENT MODULE USING SAME
#76Sandwich structure with double-sided cooling and EMI shielding
#77Semiconductor device
#78Integrated circuit package system with warp-free chip
#79Light-emitting diode package
#80SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF
#81THERMOSETTING DIE-BONDING FILM
#82THERMOSETTING DIE-BONDING FILM
#83ADHESIVE FILM WITH DICING SHEET AND METHOD OF MANUFACTURING THE SAME
#84SEMICONDUCTOR DEVICE AND ON-VEHICLE AC GENERATOR
#85Semiconductor device
#86Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereon
#87POWER SEMICONDUCTOR DEVICE
#88Die-to-die electrical isolation in a semiconductor package
#89Process for producing a semiconductor device
#90Semiconductor device including two heat sinks and method of manufacturing the same
#91Integrated circuit packaging system with a dual substrate package and method of manufacture thereof
#92Semiconductor element cooling structure
#93METHOD OF MANUFACTURING DICING DIE-BONDING FILM
#94QUAD FLAT PACKAGE STRUCTURE HAVING EXPOSED HEAT SINK, ELECTRONIC ASSEMBLY AND MANUFACTURING METHODS THEREOF
#95System and method for multi-chip module die extraction and replacement
#96PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS
#97Load driving device
#98Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#99INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND PACKAGING METHOD THEREOF
#100Repairing defects in a nonvolatile semiconductor memory device utilizing a heating element
#101PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
#102Semiconductor apparatus with decoupling capacitor
#103Circuit device
#104Adhesive tape and semiconductor package using the same
#105PRESSURE-SENSITIVE ADHESIVE SHEET
#106LED package methods and systems
#107METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#108Organic lighting device and lighting equipment
#109Mounting structure of component of lighting device and method thereof
#110Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices
#111SEMICONDUCTOR DEVICE
#112POWER SEMICONDUCTOR MODULE
#113LOW-TEMPERATURE-COFIRED-CERAMIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
#114LED DEVICE AND ILLUMINATING APPARATUS
#115Thermosetting die-bonding film
#116Thermosetting die-bonding film
#117ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, AND A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE USING THE SAME
#118Light emitting elements and methods of fabricating the same
#119System-in-package module and mobile terminal having the same
#120Semiconductor chip module with stacked flip-chip unit
#121Semiconductor device
#122Stacked structure of integrated circuits having space elements
#123Semiconductor module molded by resin with heat radiation plate opened outside from mold
#124SEMICONDUCTOR DEVICE
#125Power semiconductor module
#126Method for attaching a semiconductor die to a leadframe, and a semiconductor device
#127Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power module
#128METHOD FOR POWER SEMICONDUCTOR MODULE FABRICATION, ITS APPARATUS, POWER SEMICONDUCTOR MODULE AND ITS JUNCTION METHOD
#129PRINTED CIRCUIT BOARD HAVING ADHESIVE LAYER AND SEMICONDUCTOR PACKAGE USING THE SAME
#130Semiconductor apparatus with decoupling capacitor
#131Circuit device
#132Circuit device and method of manufacturing the same
#133Method of manufacturing integrated circuit package system with warp-free chip
#134Singulated semiconductor package
#135DIE STACKING IN MULTI-DIE STACKS USING DIE SUPPORT MECHANISMS
#136Electronic component with buffer layer
#137Semiconductor device manufacturing method
#138Rearrangement sheet, semiconductor device and method of manufacturing thereof
#139PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME
#140SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#141Integrated circuit package system with wire-in-film isolation barrier
#142Forming a semiconductor package including a thermal interface material
#143LOW TEMPERATURE THERMAL INTERFACE MATERIALS
#144Stackable package by using internal stacking modules
#145Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier
#146SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP AND ANTENNA
#147Semiconductor device
#148METHOD AND APPARATUS FOR HEAT DISSIPATION
#149Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications
#150Semiconductor device comprising a semiconductor chip stack and method for producing the same
#151SEMICONDUCTOR DEVICE
#152Package structure and manufacturing method thereof
#153Package structure and method of manufacturing the same
#154Electronic device and method for producing electronic devices
#155METHOD, APPARATUS, AND SYSTEM FOR PHASE CHANGE MEMORY PACKAGING
#156Power semiconductor module
#157Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#158Semiconductor device and method of manufacturing the same
#159Thermosetting die bonding film
#160CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL, AND SEMICONDUCTOR DEVICE
#161Semiconductor device including semiconductor elements and method of producing semiconductor device
#162Chip arrangement and method for producing a chip arrangement
#163Semiconductor Device
#164MOSFET package
#165ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY CONDUCTIVE BODY
#166Semiconductor device with lead frame including conductor plates arranged three-dimensionally
#167Three-dimensional package and method of making the same
#168Stress management in BGA packaging
#169Liquid metal thermal interface material system
#170Stacked die in die BGA package
#171Double Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
#172Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#173Reduction of damage to thermal interface material due to asymmetrical load
#174Semiconductor Device And Production Method For Semiconductor Device
#175Stacked die with a recess in a die BGA package
#176HEAT CURABLE ADHESIVE COMPOSITION, ARTICLE, SEMICONDUCTOR APPARATUS AND METHOD
#177Processes and packaging for high voltage integrated circuits, electronic devices, and circuits
#178Power semiconductor module
#179Semiconductor device
#180Semiconductor apparatus having improved thermal fatigue life
#181Method of fabricating a stacked die having a recess in a die BGA package
#182Conductive adhesive rework method
#183Load driving device
#184Semiconductor device
#185Semiconductor apparatus with decoupling capacitor
#186Semiconductor package and method of assembling the same
#187Semiconductor device having a bonding wire and method for manufacturing the same
#188Stacked package electronic device
#189Semiconductor device and method for manufacturing the same
#190Conductive adhesive composition
#191Methods and apparatus having an integrated circuit attached to fused silica
#192Surface-mountable optoelectronic component
#193Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the same
#194Circuit device and method of manufacturing the same
#195Method for designing semiconductor package, system for aiding to design semiconductor package, and computer program product therefor
#196Chip stack package
#197Method of manufacturing semiconductor device
#198Method for manufacturing mold type semiconductor device
#199Overhang integrated circuit package system
#200Multichip leadframe package
#201Semiconductor device having semiconductor element, insulation substrate and metal electrode
#202ADHESIVE SHEET, SEMICONDUCTOR DEVICE HAVING THE SAME, MULTI-STACKED PACKAGE HAVING THE SAME, AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A MULTI-STACKED PACKAGE
#203Light emitting device
#204High-temperature solder, high-temperature solder paste and power semiconductor using same
#205Method of making a semiconductor device with improved heat dissipation
#206Bonding method of semiconductor substrate and sheet, and manufacturing method of semiconductor chips using the same
#207Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component
#208Electronic module and method of assembling the same
#209Semiconductor device and method for manufacturing thereof
#210Semiconductor device with semiconductor chip and adhesive film and method for producing the same
#211Power semiconductor module with MOS chip
#212Semiconductor manufacturing method
#213Method for designing semiconductor apparatus, system for aiding to design semiconductor apparatus, computer program product therefor and semiconductor package
#214Semiconductor device having metallic plate with groove
#215Resin mold type semiconductor device
#216Die pad for semiconductor packages and methods of making and using same
#217Semiconductor device
#218Semiconductor device
#219MOSFET package
#220MOSFET package
#221Semiconductor device
#222Method of making a stacked die package
#223Semiconductor device
#224Semiconductor device and manufacturing method thereof
#225Spacer die structure and method for attaching
#226Method of fabricating a stacked die in die BGA package
#227Method of fabricating a stacked die in die BGA package
#228Stacked die in die BGA package
#229Chip-on-board assemblies
#230Assembly structure and method for chip scale package
#231Nanotube materials for thermal management of electronic components
#232Thermal management of systems having localized regions of elevated heat flux
#233Large die package and method for the fabrication thereof
#234Heat sink member and method of manufacturing the same
#235Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate
#236Method of fabricating semiconductor chip assemblies
#237Stacked die-in-die BGA package with die having a recess
#238Semiconductor device
#239High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package
#240MOSFET package
#241MOSFET package
#242Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment
#243Component arrangement for series terminal for high-voltage applications
#244Semiconductor apparatus and manufacturing method
#245Method for manufacturing semiconductor device having a pair of heat sinks
#246Semiconductor device and manufacturing method of the same
#247Semiconductor device, method and apparatus for fabricating the same
#248Thermal management of systems having localized regions of elevated heat flux
#249Semiconductor device having aluminum electrode and metallic electrode
#250Multichip leadframe package
#251Semiconductor device with improved heat dissipation, and a method of making semiconductor device
#252Semiconductor equipment having a pair of heat radiation plates
#253Electronic device and method of manufacturing the same
#254Electronic packages with dice landed on wire bonds
#255Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
#256LED package methods and systems
#257Semiconductor device with improved heat dissipation, and a method of making semiconductor device
#258Stacked package electronic device
#259Integrated circuit package including embedded thin-film battery
#260Method for manufacturing wafer level chip stack package
#261Electronic assembly having an indium wetting layer on a thermally conductive body
#262High density chip scale leadframe package and method of manufacturing the package
#263Laminated radiation member, power semiconductor apparatus, and method for producing the same
#264Semiconductor device and method of manufacturing the same
#265Thermal interface adhesive and rework
#266Die package
#267Semiconductor package for a large die
#268Semiconductor device
#269Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module
#270Heat curable adhesive composition, article, semiconductor apparatus and method
#271Spacer die structure and method for attaching
#272Spacer die structure and method for attaching
#273Power semiconductor module
#274Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof
#275Circuit device
#276Semiconductor device and method of manufacturing the same
#277Semiconductor device and fabrication method for the same
#278Electronic circuit module
#279Semiconductor device having radiation structure
#280Semiconductor device
#281Power module and power module assembly
#282Process for producing a semiconductor device
#283Structure of gold fingers
#284Reduced size semiconductor package with stacked dies
#285Method for manufacturing semiconductor device with plural semiconductor chips
#286Semiconductor device
#287Method of making semiconductor device
#288Copper-based chip attach for chip-scale semiconductor packages
#289Stacked die semiconductor device
#290Semiconductor device
#291Chip adhesive
#292Method for producing an adhesive bond and adhesive bond between a chip and a planar surface
#293Fabrication method of semiconductor package with heat sink
#294Semiconductor device having metal plates and semiconductor chip
#295Electronic device
#296Method for stacking chips within a multichip module package
#297Semiconductor device having heat radiation plate and bonding member
#298Package type semiconductor device
#299Semiconductor device having heat conducting plate
#300Semiconductor device having a pair of heat sinks and method for manufacturing the same