209814 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods; Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for aligning the layer connector, e.g. marks, spacers
Method of manufacturing substrate layered body and layered body
#2Semiconductor device including an embedded surface mount device and method of forming the same
#3Semiconductor package including an embedded surface mount device and method of forming the same
#4Semiconductor device including an embedded surface mount device and method of forming the same