H01L2224/27011 - CPC Classification Index

ClassID:

209812 ⎘

H01L2224/27011 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature

Sub-classes:

H01L2224/27013 » for holding or confining the layer connector, e.g. solder flow barrier 411
H01L2224/27015 » for aligning the layer connector, e.g. marks, spacers 4
H01L2224/27019 » for protecting parts during the process 9

Recent Application in this class:

20250293201

POWER CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

20220328377

Power semiconductor component and method for producing a power semiconductor component

20220271000

Semiconductor structure and manufacturing method thereof

20200294817

DIC package comprising perforated foil sheet

20180269178

Wafer bonding methods and wafer-bonded structures

20180076110

Backside spacer structures for improved thermal performance

20170250092

3DIC package comprising perforated foil sheet

20160343684

THERMOCOMPRESSION BONDING WITH RAISED FEATURE

20140138831

Surface finish on trace for a thermal compression flip chip (TCFC)