209815 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods; Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for protecting parts during the process
ELECTROCONDUCTIVE ADHESIVE
#2ELECTROCONDUCTIVE ADHESIVE
#3Method of manufacturing semiconductor device
#4Semiconductor devices and methods of forming thereof
#5Process for forming package-on-package structures
#6Process for forming package-on-package structures
#7Process for forming package-on-package structures
#8Semiconductor devices and methods of forming thereof
#9Process for forming package-on-package structures