209827 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the layer connector
Wafer level chip stack method
#602Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof
#603Encapsulated semiconductor components and methods of fabrication
#604Method for preparing arylphosphonite antioxidant
#605Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#606Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same
#607Dicing die-bonding film
#608Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
#609Copper-based chip attach for chip-scale semiconductor packages
#610Combination back grind tape and underfill for flip chips
#611Semiconductor device package utilizing proud interconnect material
#612Wafer level packages for chips with sawn edge protection
#613Semiconductor device with magnetically permeable heat sink
#614Method of manufacturing a semiconductor device
#615Process for strengthening semiconductor substrates following thinning
#616Method for generating chip stacks
#617Method of manufacturing a semiconductor device
#618Method of manufacturing a semiconductor device
#619Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument
#620Microelectronic component and assembly having leads with offset portions
#621Thinned, strengthened semiconductor substrates and packages including same
#622Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#623Die bonding apparatus and method for bonding semiconductor chip using the same
#624Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof
#625Devices and methods employing high thermal conductivity heat dissipation substrates
#626Methods relating to forming interconnects and resulting assemblies
#627System having semiconductor component with encapsulated, bonded, interconnect contacts
#628Resin composition for encapsulating semiconductor device
#629Semiconductor device having heat dissipation layer
#630Head assembly, disk unit, and bonding method and apparatus
#631Bumped wafer with adhesive layer encompassing bumps and manufacturing method thereof
#632Method of manufacturing wafer-level chip-size package and molding apparatus used in the method
#633Dicing/die-bonding film, method of fixing chipped work and semiconductor device
#634Electronic parts packaging structure and method of manufacturing the same
#635Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device
#636Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices
#637Process for producing a semiconductor device
#638Method for manufacturing semiconductor devices
#639Semiconductor device with multi-staged cut side surfaces
#640Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#641Fabrication of stacked microelectronic devices
#642Fabrication of stacked microelectronic devices
#643Semiconductor device and semiconductor device manufacturing method
#644Semiconductor package having semiconductor constructing body and method of manufacturing the same
#645Method of manufacturing semiconductor device and manufacturing apparatus of semiconductor device
#646Method of surface-mounting semiconductor chip on PCB
#647Electronic semiconductor device having a thermal spreader
#648Method for manufacturing semiconductor device
#649Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
#650Method of fabrication of stacked semiconductor devices
#651Laminated sheet
#652Interlayer dielectric and pre-applied die attach adhesive materials
#653Pre-back-grind and underfill layer for bumped wafers and dies
#654Manufacturing method of semiconductor device
#655Semiconductor package production method and semiconductor package