Quad flat non-leaded chip package

CHIP PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURES

Adhesive composition suitable to be applied by screen printing

Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support

Method of packaging a microchip having a footprint that is larger than that of the integrated circuit

Optoelectronic device chip having a composite spacer structure and method making same

Semiconductor apparatus having a first and a second projection portion on opposite surfaces of a semiconductor wafer and method for manufacturing the same

METHOD OF PACKAGING INTEGRATED CIRCUITS

Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler

Semiconductor module manufacturing method, semiconductor module, and mobile device

Semiconductor Device and Its Fabrication Method

CONVEX DIE ATTACHMENT METHOD

Adhesive composition and a method of using the same

Marks for the Alignment of Wafer-Level Underfilled Silicon Chips and Method to Produce Same

WAFER-LEVEL BONDING FOR MECHANICALLY REINFORCED ULTRA-THIN DIE

Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device

Sheet to Form a Protective Shield for Chips

Semiconductor device

Electrical interconnect structure and method

Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device

INTEGRATED CIRCUIT DEVICES WITH INTEGRAL HEAT SINKS

Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor Device Manufacturing Method Using The Adhesive Sheet

MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE

METHOD OF MANUFACTURING DEVICE

Manufacturing method for devices

Semiconductor element connected to printed circuit board

Method of forming a silicide layer on a thinned silicon wafer, and related semiconducting structure

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Packaging methods for imager devices

Method of manufacturing device having a UV-curable adhesive

Semiconductor module, method of manufacturing semiconductor module, and mobile device

Thermosetting die bonding film

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Stackable integrated circuit package system with multiple interconnect interface

Semiconductor module, portable device and method for manufacturing semiconductor module

Method of manufacturing semiconductor devices encapsulated in chip size packages

SOLDER DEPOSITION ON WAFER BACKSIDE FOR THIN-DIE THERMAL INTERFACE MATERIAL

Method of manufacturing wafer-level chip-size package and molding apparatus used in the method

Adhesive Film and Method for Manufacturing Semiconductor Device Using Same

Semiconductor device including isolation layer

Manufacturing method of semiconductor device with smoothing

ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof

HIGHLY CONDUCTIVE COMPOSITION FOR WAFER COATING

Highly conductive composition for wafer coating

Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Stacked semiconductor chips having double adhesive insulating layer interposed therebetween

Method of manufacturing multi-layer printed circuit board

Adhesive film composition, associated dicing die bonding film, and die package

Method of processing wafer

Semiconductor device and manufacturing method therefor

Semiconductor module, method for manufacturing semiconductor modules and mobile device

Adhesive composition, adhesive sheet and production process for semiconductor device

Flip-chip assembly and method of manufacturing the same

Method for manufacturing semiconductor device

Packaged semiconductor chips with array

Film and chip packaging process using the same

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

HEAT CURABLE ADHESIVE COMPOSITION, ARTICLE, SEMICONDUCTOR APPARATUS AND METHOD

Dicing die-bonding film

Semiconductor device and method for manufacturing the same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

FIXING APPARATUS FOR SEMICONDUCTOR WAFER

Method for fabricating resin-molded semiconductor device having posts with bumps

Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Thin flip-chip method

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer

Integrated circuit package system employing wafer level chip scale packaging

Semiconductor device and manufacturing method for the same

Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein

Semiconductor package and method of fabricating the same and semiconductor module and method of fabricating the same

Methods and apparatus for packaging integrated circuit devices

Integrated circuit package system employing an exposed thermally conductive coating

Sheet Peeling Apparatus and Peeling Method

Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Wafer-level bonding for mechanically reinforced ultra-thin die

Wafer-level assembly of heat spreaders for dual IHS packages

Die configurations and methods of manufacture

Method of manufacturing a semiconductor device

Micro universal serial bus (USB) memory package

Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device

Semiconductor device package utilizing proud interconnect material

Interlayer dielectric and pre-applied die attach adhesive materials

Method for producing a chip-substrate connection

Semiconductor component with connecting elements and method for producing the same

Semiconductor device

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Semiconductor chip, method of manufacturing the semiconductor chip and semiconductor chip package

Optoelectronic device chip having a composite spacer structure and method making same

Micro-package, multi-stack micro-package, and manufacturing method therefor

Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion

Flip chip mounted semiconductor device package having a dimpled leadframe

Method of dividing an adhesive film bonded to a wafer

Wafer level semiconductor module and method for manufacturing the same

Method of wafer level chip size packaging

Direct-write wafer level chip scale package

Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device

Adhesive sheet, semiconductor device, and process for producing semiconductor device

Chip scale surface mount package for semiconductor device and process of fabricating the same

Semiconductor device having adhesion increasing film to prevent peeling

Methods and materials useful for chip stacking, chip and wafer bonding

Semiconductor device manufacturing method

Gold/silicon eutectic die bonding method

Carbon nanotube via interconnect

METHOD FOR DICING A WAFER

Die bonding

Manufacturing method of a semiconductor device

Manufacturing method of semiconductor device

Flip-chip type semiconductor device

Chip package and wafer treating method for making adhesive chips

Wafer level chip scale package system with a thermal dissipation structure

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Method for manufacturing semiconductor device

Stackable integrated circuit package system with multiple interconnect interface

Semiconductor device and semiconductor module therewith

Chip stack package

Semiconductor package having an optical device and a method of making the same

Electronic device and method of manufacturing the same

Stacked integrated circuit package system with face to face stack configuration

Microelectronic devices and methods for manufacturing microelectronic devices

Highly reliable, cost effective and thermally enhanced AuSn die-attach technology

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device, interposer chip and manufacturing method of semiconductor device

Adhesive film and method for forming metal film using same

Dicing/die bonding film and method of manufacturing the same

Semiconductor chip with bond area

Back-to-front via process

Methods of forming back side layers for thinned wafers

Multi-chip package system

Wafer-level processing of chip-packaging compositions including bis-maleimides

Wafer level package having a stress relief spacer and manufacturing method thereof

Method for fabricating a chip scale package using wafer level processing

Semiconductor device

Method of producing a semiconductor device, and wafer-processing tape

Electronic device and semiconductor device

Semiconductor device and manufacturing method of the same

ADHESIVE SHEET, SEMICONDUCTOR DEVICE HAVING THE SAME, MULTI-STACKED PACKAGE HAVING THE SAME, AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A MULTI-STACKED PACKAGE

Dicing die-bonding film, method of fixing chipped work and semiconductor device

Electronic member fabricating method and ic chip with adhesive material

Die bonding adhesive tape

Semiconductor device manufacturing method

Dicing and die bonding adhesive tape

Methods for fabricating protective layers on semiconductor device components

Method of fabricating a multi-die semiconductor package assembly

Semiconductor devices including voltage switchable materials for over-voltage protection

Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding

Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device

Production method for device

Adhesive composition and sheet having an adhesive layer of the composition

Semiconductor device having a semiconductor chip, and method for the production thereof

Semiconductor device with semiconductor chip and adhesive film and method for producing the same

Semiconductor package having an interfacial adhesive layer

Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same

Semiconductor manufacturing method

Integrated circuit package system with planar interconnects

Electronic device and manufacturing method therefor

Semiconductor wafer level chip package and method of manufacturing the same

Adhesive film having multiple filler distribution and method of manufacturing the same, and chip stack package having the adhesive film and method of manufacturing the same

Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts

Wafer-level package and IC module assembly method for the wafer-level package

Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology

Microelectronic devices and methods for manufacturing microelectronic devices

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Semiconductor device and a manufacturing method of the same

Semiconductor package with contact support layer and method to produce the package

Process for exposing solder bumps on an underfill coated semiconductor

Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate

Wafer level package and its manufacturing method

Fabrication method of semiconductor circuit device

Micro-package, multi-stack micro-package, and manufacturing method therefor

Substrate for manufacturing semiconductor device, semiconductor device manufacturing method

SEMICONDUCTOR PACKAGE WITH MOLDED BACK SIDE AND METHOD OF FABRICATING THE SAME

Dicing die bonding film

Adhesive substrate and method for using

Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer

Process of manufacture of ultra thin semiconductor wafers with bonded conductive hard carrier

Wafer level bumpless method of making a flip chip mounted semiconductor device package

Method of manufacturing a substrate-free flip chip light emitting diode

Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors

Semiconductor device and the manufacturing method for the same

Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat

Wafer level pre-packaged flip chip systems

Microelectronic assemblies having compliant layers

Wafer level pre-packaged flip chip

Wafer level pre-packaged flip chip

Wafer level pre-packaged flip chip system

Devices incorporating carbon nanotube thermal pads

Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device

Circuit device and method of manufacturing thereof

Semiconductor device having reinforcement member and method of manufacturing the same

Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices

Method for fabricating a semiconductor device having a heat radiation layer

Semiconductor device production method and semiconductor device

Solder deposition on wafer backside for thin-die thermal interface material

Microelectronic component and assembly having leads with offset portions

Dicing die adhesive film for semiconductor

Microelectronic assemblies having compliant layers

Semiconductor substrate

Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component

Semiconductor device having a functional surface

Underfill on substrate process and ultra-fine pitch, low standoff chip-to-package interconnections produced thereby

Semiconductor package fabrication

Wafer-processing tape

Chip package and fabricating method thereof

Semiconductor package having an optical device and a method of making the same

Underfill encapsulant for wafer packaging and method for its application

Circuit device and manufacturing method thereof

Method of manufacturing an electronic device

Semiconductor device and manufacturing method thereof

Semiconductor component sealed on five sides by polymer sealing layer

Fabrication of stacked microelectronic devices

Apparatus, system, and method for reducing integrated circuit peeling

Method and apparatus for wafer to wafer bonding

Methods relating to forming interconnects

Fabrication of stacked microelectronic devices

Wafer-processing tape and method of producing the same

Method for cutting semiconductor substrate

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

Semiconductor package having semiconductor constructing body and method of manufacturing the same

Hot-Melt Underfill Composition and Methos of Application

Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component

Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method

Method of manufacturing semiconductor device and support structure for semiconductor substrate

B-stageable underfill encapsulant and method for its application

Wafer-level underfill process making use of sacrificial contact pad protective material

Method of fabrication of stacked semiconductor devices

Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts

Microelectronic packages with solder interconnections

Ultra-thin semiconductor package device and method for manufacturing the same

Flip-chip semiconductor device utilizing an elongated tip bump

Wafer-level diamond spreader

Methods for marking a bare semiconductor die including applying a tape having energy-markable properties

Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device

Fabricating method of wafer protection layers

Wafer stacking package method

Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device

Method of manufacturing a semiconductor device

Manufacturing method of stack-type semiconductor device

Electronic devices at the wafer level having front side and edge protection material and systems including the devices

Apparatus for dividing an adhesive film mounted on a wafer

Method of fabricating semiconductor device

Method for fabricating semiconductor package with circuit side polymer layer

Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods

Wafer-level diamond spreader

Semiconductor device with magnetically permeable heat sink

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Method for manufacturing wafer level chip stack package

Semiconductor component and system having thinned, encapsulated dice

Semiconductor device having adhesion increasing film to prevent peeling

Refractory solid, adhesive composition, and device, and associated method

Method of manufacturing semiconductor device and support structure for semiconductor substrate

Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof

Underfilling with acid-cleavable acetal and ketal epoxy oligomers

Semiconductor device and multilayer substrate therefor

Electronic device and method of manufacture the same

Method for fabricating encapsulated semiconductor components

Dicing die bonding film

Heat curable adhesive composition, article, semiconductor apparatus and method

Die with discrete spacers and die spacing method

Wafer support and release in wafer processing

Semiconductor flip-chip package and method for the fabrication thereof

Microelectronic assembly having encapsulated wire bonding leads

Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion

Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same

Dicing die-bonding film

Thin flip-chip method

Semiconductor device with recessed post electrode

Methods and apparatus for packaging integrated circuit devices

Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts

Semiconductor component assemblies having interconnects

Device mounting method and device transport apparatus

Resin-molded semiconductor device having posts with bumps and method for fabricating the same

Semiconductor device assembly process

Process for producing semiconductor chips having a protective film on the back surface

Method of manufacturing semiconductor device

Sheet to form a protective film for chips

Wafer level semiconductor component having thinned, encapsulated dice and polymer dam

Method for manufacturing thin semiconductor chip

Semiconductor device including semiconductor element mounted on another semiconductor element

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Semiconductor device, its fabrication method and electronic device

Semiconductor device and method of manufacturing same

Method for fabricating a chip scale package using wafer level processing

Semiconductor device

Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus

Resin composition for encapsulating semiconductor

Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same

Die attach by temperature gradient lead free soft solder metal sheet or film

Process for producing a semiconductor device

Semiconductor device including semiconductor elements mounted on base plate