209836 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the layer connector in solid form
Sub-classes:WAFER BONDING WITH ENHANCED THERMAL DISSIPATION
#2PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU
#3Chip assembly
#4Chip assembly
#5Anisotropic conductive film and production method of the same
#6Semiconductor device and method for manufacturing the same