209838 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the layer connector in solid form using a powder
Semiconductor Device and Connecting Method
#2SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON EMITTER ARRAY CHIPS
#3Systems and methods for fabricating silicon die stacks for electron emitter array chips
#4Semiconductor chip metal alloy thermal interface material
#5Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methods
#6Method of attaching an electronic part to a copper plate having a surface roughness
#7Method for producing a material-bonding connection between a semiconductor chip and a metal layer
#8Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement
#9Solder paste
#10Circuit arrangement for a thermally conductive chip assembly and a manufacturing method
#11Method for producing a metal layer on a substrate and device
#12Contacting means and method for contacting electrical components