H01L2224/27444 - CPC Classification Index

ClassID:

209839 ⎘

H01L2224/27444 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the layer connector in gaseous form

Sub-classes:

H01L2224/2745 » Physical vapour deposition [PVD], e.g. evaporation, or sputtering 107
H01L2224/27452 » Chemical vapour deposition [CVD], e.g. laser CVD 65

Recent Application in this class:

20240145366

2024-05-02

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

20200165494

2020-05-28

Enhanced adhesive materials and processes for 3D applications

20180340100

2018-11-29

Enhanced adhesive materials and processes for 3D applications

20180200840

2018-07-19

Low-temperature bonding with spaced nanorods and eutectic alloys

20170229423

2017-08-10

METHOD FOR PERMANENTLY BONDING WAFERS

20160071817

2016-03-10

Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas

20160027759

2016-01-28

Process for connecting joining parts

20150228535

2015-08-13

Bonded processed semiconductor structures and carriers

20150104902

2015-04-16

Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements

#10

20140346643

2014-11-27

Integrated bondline spacers for wafer level packaged circuit devices

#11

20140193948

2014-07-10

Integrated bondline spacers for wafer level packaged circuit devices

#12

20140124899

2014-05-08

Integrated bondline spacers for wafer level packaged circuit devices

#13

20140017877

2014-01-16

Method for permanently bonding wafers

#14

20130256907

2013-10-03

Bonded processed semiconductor structures and carriers

#15

20120013013

2012-01-19

Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region

#16

20110081738

2011-04-07

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

#17

20060097354

2006-05-11