Patents-Review.com
ClassID:

209846 ⎘

H01L2224/2747 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods using a lift-off mask

Sub-classes:
Recent Application in this class:
#1
20250364484
2025-11-27

BONDING ARRANGEMENT HAVING A METAL INVERSE OPALS LAYER

 #2
20250183230
2025-06-05

CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

 #3
20250006692
2025-01-02

Method for packaging stacking flip chip

 #4
20240113066
2024-04-04

ELECTRONIC DEVICE

 #5
20230369276
2023-11-16

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

 #6
20230215852
2023-07-06

Display Device and Method of Manufacturing the Same

 #7
20220157761
2022-05-19

Method for fabricating semiconductor device including etching an edge portion of a bonding layer by using an etching mask

 #8
20220028819
2022-01-27

Package process, DAF replacement

 #9
20210098397
2021-04-01

Semiconductor device and method

 #10
20200248040
2020-08-06

Method of manufacturing an electronic device

 #11
20190273055
2019-09-05

Semiconductor device and method

 #12
20180148319
2018-05-31

Hermetically sealed MEMS device and its fabrication

 #13
20180114766
2018-04-26

Method of manufacturing semiconductor device

 #14
20180072923
2018-03-15

Conductive paste for bonding

 #15
20170033066
2017-02-02

Semiconductor devices and methods of forming thereof

 #16
20170012034
2017-01-12

Semiconductor device

 #17
20160190089
2016-06-30

Wafer to wafer bonding process and structures

 #18
20160141256
2016-05-19

Method for manufacturing a semiconductor device, and semiconductor device

 #19
20150140806
2015-05-21

Wafer-level die attach metallization

 #20
20150123264
2015-05-07

Semiconductor devices and methods of forming thereof

 #21
20150097294
2015-04-09

Method for processing a wafer and wafer structure

 #22
20150069591
2015-03-12

Method for manufacturing a semiconductor device, and semiconductor device

 #23
20140217156
2014-08-07

Joining method and semiconductor device manufacturing method

 #24
20140035168
2014-02-06

Bonding pad for thermocompression bonding, process for producing a bonding pad and component

 #25
20130285248
2013-10-31

Package structure and substrate bonding method

 #26
20130134210
2013-05-30

Joining method and semiconductor device manufacturing method

 #27
20130049229
2013-02-28

Semiconductor chip device with solder diffusion protection

 #28
20130001775
2013-01-03

Conductive connecting member and manufacturing method of same

 #29
20110147916
2011-06-23

Semiconductor chip device with solder diffusion protection

 #30
20110081738
2011-04-07

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

 #31
20100171097
2010-07-08

Detection device and method for manufacturing the same

 #32
20060097354
2006-05-11

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head