H01L2224/27472 - CPC Classification Index

ClassID:

209847 ⎘

H01L2224/27472 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods using a lift-off mask Profile of the lift-off mask

Recent Application in this class:

20250372564

2025-12-04

B-STAGE ADHESIVE FOR AN INTERCONNECT

20250105195

2025-03-27

ELECTRONIC COMPONENT PACKAGE HAVING A METAL PLATE STRUCTURE THAT INCLUDES A TAPERED FOOT PORTION

20170301612

2017-10-19

Semiconductor device and method for manufacturing the same

20120153461

2012-06-21

SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT, AND MANUFACTURING METHOD OF JOINING STRUCTURE