209850 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
Sub-classes:SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
#2SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
#3SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
#4Semiconductor package and method of forming same
#5METHOD FOR MANUFACTURING MEMBER TO BE TREATED AND LAMINATE
#6Through-substrate-vias with self-aligned solder bumps
#7Through-substrate-vias with self-aligned solder bumps
#8Method for performing direct bonding between two structures
#9COPPER CLAD LAMINATE HAVING BARRIER STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#10Solderless die attach to a direct bonded aluminum substrate
#11Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
#12Semiconductor device and production method therefor
#13Solderless die attach to a direct bonded aluminum substrate
#14Sintering materials and attachment methods using same
#15Semiconductor device and production method therefor
#16CONTROLLING THE POROSITY OF METAL PASTES FOR PRESSURE FREE, LOW TEMPERATURE SINTERING PROCESS