209859 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material Selective modification
Sub-classes:Display Device and Method of Manufacturing the Same
#2Contact structures with porous networks for solder connections, and methods of fabricating same
#3Filler particle position and density manipulation with applications in thermal interface materials
#4Selectively cross-linked thermal interface materials
#5Selectively cross-linked thermal interface materials
#6Process for producing a structure by assembling at least two elements by direct adhesive bonding
#7Low-stress dual underfill packaging
#8Low-stress dual underfill packaging
#9Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer