209868 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by patterning a pre-deposited material using masks
Sub-classes:WAFER-TO-WAFER BONDING STRUCTURE AND FABRICATION METHOD THEREOF
#2SEMICONDUCTOR MANUFACTURING METHOD
#3Seal ring structures and methods of forming same
#4Semiconductor wafer and method of manufacturing the same
#5Seal ring structures and methods of forming same
#6Seal ring structures and methods of forming same
#7Laterally extended conductive bump buffer
#8Stacked semiconductor structure
#9Wafer bonding methods and wafer-bonded structures
#10Seal ring structures and methods of forming same
#11THERMOCOMPRESSION BONDING WITH RAISED FEATURE
#12Semiconductor device and method of manufacturing the same