H01L2224/276 - CPC Classification Index

ClassID:

209861 ⎘

H01L2224/276 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by patterning a pre-deposited material

Sub-classes:

H01L2224/27602 » Mechanical treatment, e.g. polishing, grinding 13
H01L2224/2761 » Physical or chemical etching 26
H01L2224/27618 » with selective exposure, development and removal of a photosensitive layer material, e.g. of a photosensitive conductive resin 37
H01L2224/2762 » using masks 11
H01L2224/2763 » using a laser or a focused ion beam [FIB] 3

Recent Application in this class:

20210183806

2021-06-17

Processes for adjusting dimensions of dielectric bond line materials and related films, articles and assemblies

20210167035

2021-06-03

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON FORMATION OF INTER-DIFFUSION LAYERS

20190198376

2019-06-27

Wafer level flat no-lead semiconductor packages and methods of manufacture

20190198375

2019-06-27

Wafer level flat no-lead semiconductor packages and methods of manufacture

20190198374

2019-06-27

Wafer level flat no-lead semiconductor packages and methods of manufacture

20180174881

2018-06-21

Wafer level flat no-lead semiconductor packages and methods of manufacture

20170117246

2017-04-27

Method and apparatus for creating a bond between objects based on formation of inter-diffusion layers

20160071814

2016-03-10

Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement