209871 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by patterning a pre-deposited material using a laser or a focused ion beam [FIB] Ablation by means of a laser or focused ion beam [FIB]
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
#2INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
#3Integration and bonding of micro-devices into system substrate
#4Integration and bonding of micro-devices into system substrate
#5Bonding method for connecting two wafers
#6Semiconductor device mounting method
#7Method for wafer level packaging