209874 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods; Post-treatment of the layer connector Cleaning, e.g. oxide removal step, desmearing
LAND-SIDE DIE COOLING OF DOUBLE-SIDED PACKAGE SUBSTRATES
#2SINTERING FOR SEMICONDUCTOR DEVICE ASSEMBLIES
#3SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE
#4BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING THE SAME
#5Bonding structures of integrated circuit devices and method forming the same
#6Semiconductor device with metal silicide layer
#7Bonding structures of integrated circuit devices and method forming the same
#8Die encapsulation in oxide bonded wafer stack
#9Vertical nanoribbon array (VERNA) thermal interface materials with enhanced thermal transport properties
#10Die encapsulation in oxide bonded wafer stack
#11Method for performing direct bonding between two structures
#12Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas
#13Integrated circuit package and method of making same
#14Reducing formation of oxide on solder
#153D integrated heterostructures having low-temperature bonded interfaces with high bonding energy
#16Bonding pad for thermocompression bonding, process for producing a bonding pad and component
#17Integrated circuit package and method of making same
#18Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor package
#19METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR SEMICONDUCTOR PACKAGE
#20Reducing formation of oxide on solder
#21Low-temperature bonding process
#22Semiconductor manufacturing method and associated semiconductor manufacturing system