209880 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods; Post-treatment of the layer connector; Applying permanent coating, e.g. in-situ coating Plating, e.g. electroplating, electroless plating
Porous Cu on Cu surface for semiconductor packages
#2Bonding pad for thermocompression bonding, process for producing a bonding pad and component
#3Electronic component mounting structure
#4Semiconductor device, circuit board, electro-optic device, electronic device