H01L2224/2782 - CPC Classification Index

ClassID:

209875 ⎘

H01L2224/2782 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods; Post-treatment of the layer connector Applying permanent coating, e.g. in-situ coating

Sub-classes:

H01L2224/27821 » Spray coating 1
H01L2224/27822 » by dipping, e.g. in a solder bath 0
H01L2224/27823 » Immersion coating, e.g. in a solder bath 2
H01L2224/27824 » Chemical solution deposition [CSD], i.e. using a liquid precursor 0
H01L2224/27825 » Plating, e.g. electroplating, electroless plating 4
H01L2224/27826 » Physical vapour deposition [PVD], e.g. evaporation, or sputtering 4
H01L2224/27827 » Chemical vapour deposition [CVD], e.g. laser CVD 1

Recent Application in this class:

20210398931

Connection structure

20200343211

Connection structure

20200098718

Connection structure

20190237424

Connection structure and method for manufacturing connection structure

20180200840

Low-temperature bonding with spaced nanorods and eutectic alloys

20170144221

Sintering materials and attachment methods using same

20120115305

Method and structure for wafer to wafer bonding in semiconductor packaging