209883 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods; Post-treatment of the layer connector Reworking, e.g. shaping
Sub-classes:CHIP PACKAGE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND METHOD FOR FORMING THE SAME
#2SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
#3INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
#4Semiconductor structure and forming method thereof
#5Hybrid pocket post and tailored via dielectric for 3D-integrated electrical device
#6Thermocompression bond tips and related apparatus and methods
#7Semiconductor device comprising a can housing a semiconductor die which is embedded by an encapsulant
#8Selectively cross-linked thermal interface materials
#9Nanoscale interconnect array for stacked dies
#10Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#11Power electronics assembly having an adhesion layer, and method for producing said assembly
#12Thermocompression bond tips and related apparatus and methods
#13Selectively cross-linked thermal interface materials
#14Method for simultaneously bonding multiple chips of different heights on flexible substrates using anisotropic conductive film or paste
#15Nanoscale interconnect array for stacked dies
#16Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#17Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#18Semiconductor device mounting method
#19Method for manufacturing semiconductor device
#20Optoelectronic component with a pre-oriented molecule configuration and method for producing an optoelectronic component with a pre-oriented molecule configuration
#21STACKING METHOD AND STACKING CARRIER
#22Method and structure for wafer to wafer bonding in semiconductor packaging
#23Stacking method and stacking carrier
#24MOLDED DIELECTRIC LAYER IN PRINT-PATTERNED ELECTRONIC CIRCUITS
#25Molded dielectric layer in print-patterned electronic circuits