209885 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods; Post-treatment of the layer connector; Reworking, e.g. shaping involving a mechanical process, e.g. planarising the layer connector
MICROBUMP UNDERFILL FILLET REMOVAL IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME
#2METHOD FOR MANUFACTURING AN ELECTRONIC CHIP HAVING AN ELECTROMAGNETIC SHIELDING
#3SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#4INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
#5SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
#6SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING METHOD THEREOF
#7DIE ON DIE BONDING STRUCTURE
#8ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE LAYER, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#9FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
#10INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
#11NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#12INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
#13PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#14SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#15SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#16MICROBUMP UNDERFILL FILLET REMOVAL IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME
#17SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE
#18SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#19Fingerprint sensor and manufacturing method thereof
#20Die on die bonding structure
#21Integrated circuit package and method of forming same
#22Wafer on wafer bonding structure
#23Semiconductor device with connection structure and method for fabricating the same
#24Semiconductor device with connection structure and method for fabricating the same
#25Thermocompression bond tips and related apparatus and methods
#26Fingerprint sensor and manufacturing method thereof
#27Die encapsulation in oxide bonded wafer stack
#28Power electronics assembly having an adhesion layer, and method for producing said assembly
#29Thermocompression bond tips and related apparatus and methods
#30Die encapsulation in oxide bonded wafer stack
#31Fingerprint sensor and manufacturing method thereof
#32PACKAGE WITH DIELECTRIC OR ANISOTROPIC CONDUCTIVE (ACF) BUILDUP LAYER
#33Heat isolation structures for high bandwidth interconnects
#34Fingerprint sensor and manufacturing method thereof
#35Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas
#36Optoelectronic component with a pre-oriented molecule configuration and method for producing an optoelectronic component with a pre-oriented molecule configuration
#37Semiconductor device and method for manufacturing the same
#38Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer
#39Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same
#40Semiconductor device
#41Composition and methods of forming solder bump and flip chip using the same
#42Package with dielectric or anisotropic conductive (ACF) buildup layer
#43Semiconductor device connected by anisotropic conductive film
#44Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
#45Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same
#46Semiconductor device including a polymer disposed on a carrier
#47Junction material, manufacturing method thereof, and manufacturing method of junction structure
#48Embedded electrical component surface interconnect
#49Wafer dicing employing edge region underfill removal
#50Semiconductor package with improved pillar bump process and structure
#51Method for dispensing solder on a substrate and method for mounting semiconductor chips
#52SEMICONDUCTOR DEVICE CHIP MOUNTING METHOD
#53Power device with bottom source electrode
#54Method and structure for wafer to wafer bonding in semiconductor packaging
#55Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device
#56Semiconductor package
#57INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND METHOD OF MANUFACTURE THEREOF
#58Integrated (multilayer) circuits and process of producing the same
#59Composition and methods of forming solder bump and flip chip using the same
#60METHOD FOR FABRICATING ELECTRONIC DEVICE HAVING FIRST SUBSTRATE WITH FIRST RESIN LAYER AND SECOND SUBSTRATE WITH SECOND RESIN LAYER ADHERED TO THE FIRST RESIN LAYER
#61MOLDED DIELECTRIC LAYER IN PRINT-PATTERNED ELECTRONIC CIRCUITS
#62Method for processing a base that includes connecting a first base to a second base with an insulating film
#63Method for processing a base that includes connecting a first base to a second base
#64Molded dielectric layer in print-patterned electronic circuits
#65Wafer-level package and IC module assembly method for the wafer-level package
#66Electronic device and method for fabricating the same
#67Method for processing a base that includes connecting a first base to a second base with an insulating film
#68Method of connecting base materials
#69Method for minimizing average surface roughness of soft metal layer for bonding