209888 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods; Post-treatment of the layer connector; Thermal treatments, e.g. annealing, controlled cooling Reflowing
ELECTRONIC COMPONENT
#2SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
#3SEMICONDUCTOR DEVICE
#4DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME
#5Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement
#6Back side metallization
#7Back side metallization
#8Cooling bond layer and power electronics assemblies incorporating the same
#9Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device
#10DIE BONDING TO A BOARD
#113D packaging method for semiconductor components
#123D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
#13Method of manufacturing semiconductor device
#143D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
#15Die bonding to a board
#16Electronic Assembly for Prognostics of Solder Joint
#17Solder paste
#18Metallic thermal joint for high power density chips
#19I/O pad structures for integrated circuit devices
#20Back side metallization
#21Back side metallization
#22Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding process