209887 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods; Post-treatment of the layer connector Thermal treatments, e.g. annealing, controlled cooling
Sub-classes:SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#2Semiconductor Device and Connecting Method
#3SINTERING FOR SEMICONDUCTOR DEVICE ASSEMBLIES
#4SINTERABLE ELECTRICAL CONTACT ON A SEMICONDUCTOR SUBSTRATE
#5SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
#6PACKAGE STRUCTURE INCLUDING A BACKSIDE METAL FILM ON A SEMICONDUCTOR DIE AND A THERMALLY CONDUCTIVE UNDERFILL LAYER ON THE BACKSIDE METAL FILM AND METHODS OF FORMING THE SAME
#7DIE IN DIE SEMICONDUCTOR DEVICE AND METHOD THEREFOR
#8Manufacturing method of a system in package having several layers and associated manufacturing installation
#9Reducing warpage in a package of stacked integrated circuit dies
#10SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
#11ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR DEVICES
#12INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION
#13WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME
#14OPTICAL SENSOR PACKAGE
#15SINTERING FILM FRAMES AND RELATED METHODS
#16DOUBLE-SIDE COOLED POWER MODULES WITH SINTERED-SILVER INTERPOSERS
#17ELECTRONIC DEVICE
#18INTEGRATED CIRCUIT PACKAGE
#19SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER
#20Atomic layer deposition bonding layer for joining two semiconductor devices
#21Semiconductor structure having silver-indium transient liquid phase bonding joint
#22Silver-indium transient liquid phase method of bonding semiconductor device and heat-spreading mount and semiconductor structure having silver-indium transient liquid phase bonding joint
#23Semiconductor device that uses bonding layer to join semiconductor substrates together
#24Manufacturing method of device chip
#25Manufacturing method for semiconductor apparatus and semiconductor apparatus
#26Filler particle position and density manipulation with applications in thermal interface materials
#27Method of manufacturing semiconductor device that uses bonding layer to join semiconductor substrates together
#28Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#29Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device
#30Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member
#31Electronic sandwich structure with two parts joined together by means of a sintering layer
#32Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
#33Thermal bonding sheet and thermal bonding sheet with dicing tape
#34MANUFACTURING METHOD FOR PACKAGE DEVICE
#35Method for simultaneously bonding multiple chips of different heights on flexible substrates using anisotropic conductive film or paste
#36SURFACE REACTIVE CROSSLINKABLE COPOLYMERS
#373D bonded semiconductor structure with an embedded capacitor
#38Packaged IC With Solderable Sidewalls
#39CONDUCTIVE BONDED ASSEMBLY OF ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE USING SAME, AND METHOD OF PRODUCTION OF CONDUCTIVE BONDED ASSEMBLY
#40Bonding material and bonding method using same
#41Method for manufacturing semiconductor apparatus, method for manufacturing flip-chip type semiconductor apparatus, semiconductor apparatus, and flip-chip type semiconductor apparatus
#42Die with integrated microphone device using through-silicon vias (TSVs)
#43Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#44Bonding structure and method for producing bonding structure
#45Packaged IC with solderable sidewalls
#46Sintering materials and attachment methods using same
#47Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use
#48ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
#49Anisotropic conductive film including oblique region having lower curing ratio
#50Vertically integrated wafers with thermal dissipation
#51Printed interconnects for semiconductor packages
#52Method for positioning a semiconductor chip on a carrier and method for material-fit bonding of a semiconductor chip to a carrier
#53Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methods
#54Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuit
#55MANUFACTURING METHOD OF SEMICONDUCTOR MODULE
#56Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device
#57Method for bonding with a silver paste
#58Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof
#59Method for producing a material-bonding connection between a semiconductor chip and a metal layer
#60Direct metal bonding method
#61Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#62Semiconductor device and manufacturing method for the semiconductor device
#63Vertically integrated wafers with thermal dissipation
#64Integrated circuit system with debonding adhesive and method of manufacture thereof
#65Integrated circuit package and method of making same
#66Optoelectronic component with a pre-oriented molecule configuration and method for producing an optoelectronic component with a pre-oriented molecule configuration
#67Semiconductor device including independent film layer for embedding and/or spacing semiconductor die
#68Method for bonding substrates
#69Method for handling very thin device wafers
#70Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device
#71Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device
#72Electronic device and method for fabricating an electronic device
#733D integrated heterostructures having low-temperature bonded interfaces with high bonding energy
#74Wafer back side coating as dicing tape adhesive
#75Method for producing structured sintered connection layers, and semiconductor element having a structured sintered connection layer
#76Method of manufacturing semiconductor device including thermal compression
#77Semiconductor packaging containing sintering die-attach material
#78Use of repellent material to protect fabrication regions in semi conductor assembly
#79Method of manufacturing a component comprising cutting a carrier
#80Integrated circuit package and method of making same
#81Semiconductor device including a polymer disposed on a carrier
#82Embedded electrical component surface interconnect
#83IC chip package and chip-on-glass structure using the same
#84PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE
#85METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS
#86Method of manufacturing semiconductor device, manufacturing program, and manufacturing apparatus
#87Method and structure for wafer to wafer bonding in semiconductor packaging
#88Sintering materials and attachment methods using same
#89Method for manufacturing semiconductor devices
#90Low-temperature bonding process
#91Method for manufacturing semiconductor device and semiconductor manufacturing apparatus
#92Method for manufacturing semiconductor device
#93MULTI CHIP STACKING WITH RELIABLE JOINING
#94Method of manufacturing a semiconductor device
#95CONTROLLING THE POROSITY OF METAL PASTES FOR PRESSURE FREE, LOW TEMPERATURE SINTERING PROCESS
#96Method for stacking devices
#97Method for manufacturing electronic substrate
#98Method for minimizing average surface roughness of soft metal layer for bonding
#99Method for polymer-assisted chip transfer
#1003D bonded semiconductor structure with an embedded capacitor
#101Nitride-enriched oxide-to-oxide 3D wafer bonding