209900 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector; Core members of the layer connector Shape
Semiconductor device with hollow interconnectors
#2Semiconductor device with hollow interconnectors
#3Sensor package structure
#4Method for assembling a carrier with components, pigment for assembling a carrier with a component and method for producing a pigment
#5SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT, AND MANUFACTURING METHOD OF JOINING STRUCTURE
#6Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same