Patents-Review.com
ClassID:

209897 ⎘

H01L2224/29 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Sub-classes:
Recent Application in this class:
#1
20250309205
2025-10-02

SEMICONDUCTOR PACKAGE HAVING CHIPS ARRANGED IN A STEP TYPE STRUCTURE

 #2
20240421109
2024-12-19

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

 #3
20230207434
2023-06-29

Chip-middle type fan-out panel-level package and packaging method thereof

 #4
20220165690
2022-05-26

Method for permanent connection of two metal surfaces

 #5
20220102253
2022-03-31

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

 #6
20210125910
2021-04-29

SEMICONDUCTOR STRUCTURE

 #7
20200243481
2020-07-30

Semiconductor wafer processing arrangement employing an adhesive sheet and method for processing a semiconductor wafer

 #8
20190174630
2019-06-06

Burned-in Component Assembly

 #9
20180187052
2018-07-05

Conductive particle, its manufacturing method and anisotropic conductive adhesive

 #10
20180040591
2018-02-08

Integrated electronic device with transceiving antenna and magnetic interconnection

 #11
20170352635
2017-12-07

Bonding structure and method

 #12
20160322318
2016-11-03

Method for permanent connection of two metal surfaces

 #13
20160111410
2016-04-21

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

 #14
20150294946
2015-10-15

Integrated electronic device with transceiving antenna and magnetic interconnection

 #15
20150246417
2015-09-03

Mixed alloy solder paste

 #16
20150224602
2015-08-13

Mixed alloy solder paste

 #17
20140335660
2014-11-13

Bonding structure and method

 #18
20140251537
2014-09-11

Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure

 #19
20140242756
2014-08-28

Method for preparing semiconductor devices applied in flip chip technology

 #20
20140225274
2014-08-14

Method for producing structured sintered connection layers, and semiconductor element having a structured sintered connection layer

 #21
20140220742
2014-08-07

Method for forming a thin semiconductor device

 #22
20140141550
2014-05-22

Semiconductor device and production method therefor

 #23
20140110860
2014-04-24

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

 #24
20140102776
2014-04-17

Alkali silicate glass based coating and method for applying

 #25
20140070345
2014-03-13

Integrated electronic device with transceiving antenna and magnetic interconnection

 #26
20140001636
2014-01-02

Electronic component and method of manufacturing electronic component

 #27
20130342998
2013-12-26

Electronic assembly with detachable components

 #28
20130270117
2013-10-17

Indium compositions

 #29
20130241069
2013-09-19

Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body

 #30
20130135838
2013-05-30

Anisotropic conductive material and method for manufacturing same

 #31
20130134591
2013-05-30

Bonding material for semiconductor devices

 #32
20130105989
2013-05-02

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

 #33
20130092318
2013-04-18

Multilayer adhesive sheet and method for manufacturing electronic component

 #34
20130040451
2013-02-14

Method for permanent connection of two metal surfaces

 #35
20130026648
2013-01-31

FILM FOR FORMING SEMICONDUCTOR PROTECTION FILM, AND SEMICONDUCTOR DEVICE

 #36
20130009300
2013-01-10

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

 #37
20120319280
2012-12-20

Semiconductor device and bonding material for semiconductor device

 #38
20120319268
2012-12-20

CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

 #39
20120305304
2012-12-06

Electronic component module

 #40
20120292786
2012-11-22

Integrated void fill for through silicon via

 #41
20120280379
2012-11-08

Semiconductor device and method of manufacturing same

 #42
20120256326
2012-10-11

ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND PRODUCTION METHOD THEREOF

 #43
20120248596
2012-10-04

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

 #44
20120231266
2012-09-13

ADHESIVE SHEET AND ELECTRONIC COMPONENT

 #45
20120228026
2012-09-13

Anisotropic conductive film, connection structure and method of producing the same

 #46
20120223442
2012-09-06

Electronic device with aerogel thermal isolation

 #47
20120211899
2012-08-23

Semiconductor device, method for manufacturing the same, and power supply unit

 #48
20120211799
2012-08-23

POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMICONDUCTOR MODULE

 #49
20120211793
2012-08-23

Low temperature high strength metal stack for die attachment

 #50
20120196404
2012-08-02

Adhesive compositions for a semiconductor, an adhesive sheet for a semiconductor and a production method of a semiconductor device

 #51
20120181571
2012-07-19

ADHESIVE FILM FOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING LED PACKAGE USING THE SAME

 #52
20120175755
2012-07-12

SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER

 #53
20120171844
2012-07-05

Dicing die bonding film, semiconductor wafer, and semiconductor device

 #54
20120168970
2012-07-05

SPACER FORMATION FILM, METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT, SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE

 #55
20120168814
2012-07-05

ADHESIVE COMPOSITION

 #56
20120156502
2012-06-21

ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

 #57
20120153508
2012-06-21

THERMOSETTING DIE-BONDING FILM

 #58
20120153486
2012-06-21

Light emitting semiconductor element bonded to a base by a silver coating

 #59
20120149155
2012-06-14

Electronic assemblies including mechanically secured protruding bonding conductor joints

 #60
20120146228
2012-06-14

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

 #61
20120135242
2012-05-31

Thermosetting die-bonding film

 #62
20120126381
2012-05-24

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

 #63
20120126379
2012-05-24

DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM

 #64
20120125671
2012-05-24

Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded Structure

 #65
20120125659
2012-05-24

Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution

 #66
20120114972
2012-05-10

Composite nanometal paste of two-metallic-component type, bonding method, and electronic part

 #67
20120111617
2012-05-10

Electronic element unit and reinforcing adhesive agent

 #68
20120104633
2012-05-03

Electronic device and electronic apparatus

 #69
20120104134
2012-05-03

FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE

 #70
20120103515
2012-05-03

Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method

 #71
20120074561
2012-03-29

BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

 #72
20120074553
2012-03-29

Method and system for improving reliability of a semiconductor device

 #73
20120068364
2012-03-22

Device and method for manufacturing a device

 #74
20120068326
2012-03-22

Anti-tamper microchip package based on thermal nanofluids or fluids

 #75
20120056329
2012-03-08

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

 #76
20120055259
2012-03-08

Self-filleting die attach paste

 #77
20120052627
2012-03-01

Method for manufacturing semiconductor devices

 #78
20120048606
2012-03-01

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

 #79
20120040484
2012-02-16

Method for producing a semiconductor element

 #80
20120029117
2012-02-02

ADHESIVE FILM FOR SEMICONDUCTOR ASSEMBLY

 #81
20120028025
2012-02-02

ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT

 #82
20120021233
2012-01-26

Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles

 #83
20120018890
2012-01-26

Semiconductor device

 #84
20120018864
2012-01-26

BONDING STRUCTURE AND METHOD

 #85
20110315302
2011-12-29

Occam process for components having variations in part dimensions

 #86
20110311800
2011-12-22

MICROSTRUCTURE AND MICROSTRUCTURE PRODUCTION METHOD

 #87
20110309512
2011-12-22

Semiconductor device

 #88
20110298110
2011-12-08

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

 #89
20110291300
2011-12-01

DICING SHEET-ATTACHED FILM FOR FORMING SEMICONDUCTOR PROTECTION FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME, AND SEMICONDUCTOR DEVICE

 #90
20110291252
2011-12-01

Method and system for forming a thin semiconductor device

 #91
20110287250
2011-11-24

ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

 #92
20110278721
2011-11-17

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

 #93
20110268985
2011-11-03

Mixed alloy solder paste

 #94
20110263078
2011-10-27

Method for manufacturing semiconductor device

 #95
20110256666
2011-10-20

THERMOSETTING DIE BOND FILM, DICING DIE BOND FILM AND SEMICONDUCTOR DEVICE

 #96
20110254146
2011-10-20

Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape

 #97
20110241227
2011-10-06

LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

 #98
20110233756
2011-09-29

WAFER LEVEL PACKAGING WITH HEAT DISSIPATION

 #99
20110227233
2011-09-22

Packaged electronic device having metal comprising self-healing die attach material

 #100
20110223720
2011-09-15

Fabrication method for resin-encapsulated semiconductor device

 #101
20110210455
2011-09-01

Die bond film, dicing die bond film, and semiconductor device

 #102
20110205719
2011-08-25

Electronic component

 #103
20110204506
2011-08-25

Thermal interface material design for enhanced thermal performance and improved package structural integrity

 #104
20110198755
2011-08-18

Solder alloy and semiconductor device

 #105
20110186340
2011-08-04

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device

 #106
20110180939
2011-07-28

Semiconductor device having a chip bonding using a resin adhesive film and method of manufacturing the same

 #107
20110175224
2011-07-21

Bonded structure and manufacturing method for bonded structure

 #108
20110175216
2011-07-21

Integrated void fill for through silicon via

 #109
20110160339
2011-06-30

Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film

 #110
20110159713
2011-06-30

Acrylic insulating adhesive

 #111
20110156255
2011-06-30

CARBON NANOTUBE-BASED FILLER FOR INTEGRATED CIRCUITS

 #112
20110151195
2011-06-23

PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION

 #113
20110139501
2011-06-16

ELECTRONIC CHIP AND SUBSTRATE WITH SHAPED CONDUCTOR

 #114
20110127314
2011-06-02

Bonding material with exothermically reactive heterostructures

 #115
20110121451
2011-05-26

Electronic device and electronic apparatus

 #116
20110115089
2011-05-19

Semiconductor device, production method for the same, and substrate

 #117
20110110066
2011-05-12

Anisotropic conductive film

 #118
20110104873
2011-05-05

Dicing/die bonding film

 #119
20110103022
2011-05-05

Indium compositions

 #120
20110101512
2011-05-05

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

 #121
20110095433
2011-04-28

CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

 #122
20110094827
2011-04-28

HEAT-CONDUCTIVE NOISE SUPPRESSION SHEET

 #123
20110084413
2011-04-14

THERMOSETTING DIE-BONDING FILM

 #124
20110084408
2011-04-14

THERMOSETTING DIE-BONDING FILM

 #125
20110084369
2011-04-14

Device including a semiconductor chip and a carrier and fabrication method

 #126
20110079916
2011-04-07

Electronic assemblies including mechanically secured protruding bonding conductor joints

 #127
20110074023
2011-03-31

Apparatus and methods of forming an interconnect between a workpiece and substrate

 #128
20110068483
2011-03-24

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

 #129
20110068480
2011-03-24

Semiconductor device and adhesive sheet

 #130
20110068467
2011-03-24

Semiconductor device and method of manufacturing same

 #131
20110067911
2011-03-24

METHOD OF BONDING PARTS TO SUBSTRATE USING SOLDER PASTE

 #132
20110053346
2011-03-03

DICING/DIE BONDING FILM

 #133
20110049693
2011-03-03

Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof

 #134
20110046268
2011-02-24

Self-Filleting Die Attach Paste

 #135
20110042831
2011-02-24

Layered chip for use in soldering

 #136
20110037174
2011-02-17

Method of manufacturing semiconductor component, and semiconductor component

 #137
20110037166
2011-02-17

Semiconductor device

 #138
20110018122
2011-01-27

Semiconductor device

 #139
20100330745
2010-12-30

Process for producing a semiconductor device

 #140
20100327422
2010-12-30

Semiconductor chip, method of fabricating the same, and stack module and memory card including the same

 #141
20100320620
2010-12-23

Adhesive film for semiconductor and semiconductor device using the adhesive film

 #142
20100307805
2010-12-09

CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME

 #143
20100304092
2010-12-02

METHOD OF MANUFACTURING DICING DIE-BONDING FILM

 #144
20100302739
2010-12-02

Thermal interface material and method of using the same and electronic assembly having the same

 #145
20100301476
2010-12-02

Stacked package and method for forming stacked package

 #146
20100299918
2010-12-02

Method of manufacturing electronic component device

 #147
20100294552
2010-11-25

Electronic component mounted structure

 #148
20100290205
2010-11-18

ADHESIVE FILM

 #149
20100276474
2010-11-04

Method of forming an interconnect joint

 #150
20100264553
2010-10-21

Packaged electronic device having metal comprising self-healing die attach material

 #151
20100261314
2010-10-14

THERMOSETTING DIE BONDING FILM

 #152
20100258936
2010-10-14

Stacked semiconductor package

 #153
20100244283
2010-09-30

Method of joining electronic component and the electronic component

 #154
20100244214
2010-09-30

Semiconductor device and method of manufacturing same

 #155
20100197080
2010-08-05

Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method

 #156
20100193973
2010-08-05

Semiconductor wafer coated with a filled, spin-coatable material

 #157
20100193801
2010-08-05

Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same

 #158
20100190298
2010-07-29

Semiconductor device and production method therefor

 #159
20100186894
2010-07-29

Method for packing electric components on a substrate

 #160
20100173164
2010-07-08

ADHESIVE FILM AND SEMICONDUCTOR DEVICE HAVING THE SAME

 #161
20100171216
2010-07-08

Electronic device and electronic apparatus

 #162
20100170938
2010-07-08

SYSTEM AND METHOD FOR SOLDER BONDING

 #163
20100167073
2010-07-01

ADHESIVE FILM AND SEMICONDUCTOR DEVICE USING SAME

 #164
20100164671
2010-07-01

Integrated electronic device with transceiving antenna and magnetic interconnection

 #165
20100129986
2010-05-27

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

 #166
20100129964
2010-05-27

Method of manufacturing a semiconductor package with a bump using a carrier

 #167
20100124802
2010-05-20

Method of manufacturing a semiconductor package using a carrier

 #168
20100110651
2010-05-06

Method for manufacturing an electronic device

 #169
20100108140
2010-05-06

DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING

 #170
20100103630
2010-04-29

Anisotropic conductive material, connected structure, and production method thereof

 #171
20100101845
2010-04-29

Electronic Device and Manufacturing Method for Electronic Device

 #172
20100096747
2010-04-22

Semiconductor device and method of manufacturing the same

 #173
20100093154
2010-04-15

Dicing/die bonding film

 #174
20100066970
2010-03-18

Flexible electronic device and flexible display device

 #175
20100055842
2010-03-04

Thermosetting die-bonding film

 #176
20100044854
2010-02-25

Semiconductor device

 #177
20100035381
2010-02-11

Method of manufacturing stacked semiconductor device

 #178
20100019365
2010-01-28

DICING/DIE BONDING FILM

 #179
20100013095
2010-01-21

Semiconductor device, production method for the same, and substrate

 #180
20100007033
2010-01-14

Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates

 #181
20090311847
2009-12-17

Method for producing a semiconductor component

 #182
20090311520
2009-12-17

MULTI-LAYER ADHESIVE FILM FOR DIE STACKING

 #183
20090275171
2009-11-05

Methods for assembling thin semiconductor die

 #184
20090273914
2009-11-05

Apparatus and methods of forming an interconnect between a workpiece and substrate

 #185
20090273066
2009-11-05

Semiconductor device and method

 #186
20090258992
2009-10-15

Thermosetting resin composition and semiconductor sealing medium

 #187
20090246915
2009-10-01

Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor Device

 #188
20090218703
2009-09-03

Lamination Tape for Reducing Chip Warpage and Semiconductor Device Containing Such Tape

 #189
20090213548
2009-08-27

THERMALLY CONDUCTIVE PERIODICALLY STRUCTURED GAP FILLERS AND METHOD FOR UTILIZING SAME

 #190
20090212418
2009-08-27

Thermal interface material design for enhanced thermal performance and improved package structural integrity

 #191
20090197375
2009-08-06

Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them

 #192
20090166897
2009-07-02

Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same

 #193
20090166876
2009-07-02

Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead

 #194
20090166852
2009-07-02

SEMICONDUCTOR PACKAGES WITH THERMAL INTERFACE MATERIALS

 #195
20090136748
2009-05-28

Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods

 #196
20090133833
2009-05-28

Epoxy Resin Composition and Die Bonding Material Comprising the Composition

 #197
20090129029
2009-05-21

System for electronic components mounted on a circuit board

 #198
20090096087
2009-04-16

MICROELECTRONIC ASSEMBLY AND METHOD OF PREPARING SAME

 #199
20090095975
2009-04-16

LIGHT EMITTING DIODE PACKAGE

 #200
20090095513
2009-04-16

Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate

 #201
20090093109
2009-04-09

Method for producing a semiconductor device using a solder alloy

 #202
20090091021
2009-04-09

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

 #203
20090085220
2009-04-02

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING

 #204
20090072013
2009-03-19

NANO-SCALE PARTICLE PASTE FOR WIRING MICROELECTRONIC DEVICES USING INK-JET PRINTING

 #205
20090068830
2009-03-12

Microelectronic package interconnect and method of fabrication thereof

 #206
20090068474
2009-03-12

Alkali silicate glass based coating and method for applying

 #207
20090056996
2009-03-05

Electronic component module

 #208
20090051028
2009-02-26

Electronic device and electronic apparatus

 #209
20090039484
2009-02-12

Semiconductor device with semiconductor chip and method for producing it

 #210
20090014855
2009-01-15

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

 #211
20090014498
2009-01-15

COMPRESSION BONDING DEVICE

 #212
20090001611
2009-01-01

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SHEET, AND SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD

 #213
20080311738
2008-12-18

METHOD OF FORMING AN INTERCONNECT JOINT

 #214
20080296784
2008-12-04

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

 #215
20080290503
2008-11-27

Compliant thermal contactor

 #216
20080290502
2008-11-27

INTEGRATED CIRCUIT PACKAGE WITH SOLDERED LID FOR IMPROVED THERMAL PERFORMANCE

 #217
20080274593
2008-11-06

Semiconductor device package with multi-chips and method of the same

 #218
20080268255
2008-10-30

Adhesive composition and a method of using the same

 #219
20080265439
2008-10-30

Die bonding agent and a semiconductor device made by using the same

 #220
20080251935
2008-10-16

Low shrinkage polyester thermosetting resins

 #221
20080246164
2008-10-09

Soldering Method, Solder Pellet for Die Bonding, Method for Manufacturing a Solder Pellet for Die Bonding, and Electronic Component

 #222
20080242058
2008-10-02

Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device

 #223
20080224279
2008-09-18

Vertical electrical interconnect formed on support prior to die mount

 #224
20080197474
2008-08-21

Semiconductor device package with multi-chips and method of the same

 #225
20080191220
2008-08-14

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

 #226
20080188058
2008-08-07

Semiconductor device and manufacturing method thereof

 #227
20080179726
2008-07-31

Multi-chip semiconductor package and method for fabricating the same

 #228
20080173988
2008-07-24

Semiconductor device with parylene coating

 #229
20080173700
2008-07-24

SYSTEM AND METHOD FOR SOLDER BONDING

 #230
20080160315
2008-07-03

B-stageable die attach adhesives

 #231
20080150120
2008-06-26

Stacked semiconductor chips having double adhesive insulating layer interposed therebetween

 #232
20080119029
2008-05-22

WAFER SCALE THIN FILM PACKAGE

 #233
20080090085
2008-04-17

HEAT CURABLE ADHESIVE COMPOSITION, ARTICLE, SEMICONDUCTOR APPARATUS AND METHOD

 #234
20080035948
2008-02-14

Light emitting diode package

 #235
20080012103
2008-01-17

EMI ABSORBING GAP FILLING MATERIAL

 #236
20070296089
2007-12-27

Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby

 #237
20070284034
2007-12-13

Resonating conductive traces and methods of using same for bonding components

 #238
20070241434
2007-10-18

Adhesive sheet, semiconductor device, and process for producing semiconductor device

 #239
20070232026
2007-10-04

Methods and materials useful for chip stacking, chip and wafer bonding

 #240
20070231960
2007-10-04

Process for fabricating a semiconductor package

 #241
20070216012
2007-09-20

METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES

 #242
20070207592
2007-09-06

Wafer bonding of damascene-patterned metal/adhesive redistribution layers

 #243
20070207557
2007-09-06

Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip

 #244
20070187844
2007-08-16

Electronic assembly with detachable components

 #245
20070160936
2007-07-12

Adhesion method using gray-scale photolithography

 #246
20070158050
2007-07-12

Microchannel heat sink manufactured from graphite materials

 #247
20070155050
2007-07-05

Electronic device and method of manufacturing the same, circuit board, and electronic instrument

 #248
20070152194
2007-07-05

Horizontal Carbon Nanotubes by Vertical Growth and Rolling

 #249
20070145570
2007-06-28

Semiconductor device

 #250
20070138650
2007-06-21

Semiconductor device

 #251
20070138442
2007-06-21

Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof

 #252
20070135550
2007-06-14

Negative thermal expansion material filler for low CTE composites

 #253
20070117263
2007-05-24

Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material

 #254
20070111483
2007-05-17

Bonding method of semiconductor substrate and sheet, and manufacturing method of semiconductor chips using the same

 #255
20070090299
2007-04-26

Adhesive composition and sheet having an adhesive layer of the composition

 #256
20070082463
2007-04-12

Semiconductor device with semiconductor chip and adhesive film and method for producing the same

 #257
20070075402
2007-04-05

Attachment system incorporating a recess in a structure

 #258
20070054430
2007-03-08

Method of fabricating organic electroluminescent devices

 #259
20070049665
2007-03-01

Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives

 #260
20070020811
2007-01-25

Method and apparatus for attaching microelectronic substrates and support members

 #261
20070020810
2007-01-25

Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate

 #262
20070018337
2007-01-25

Method and apparatus for attaching microelectronic substrates and support members

 #263
20070018296
2007-01-25

Stacked semiconductor package having adhesive/spacer structure and insulation

 #264
20070013060
2007-01-18

Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation

 #265
20060281872
2006-12-14

Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same

 #266
20060267218
2006-11-30

Method for mounting an electronic part on a substrate using a liquid containing metal particles

 #267
20060263928
2006-11-23

Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality

 #268
20060255476
2006-11-16

Electronic assembly with controlled solder joint thickness

 #269
20060249836
2006-11-09

Chip-scale package

 #270
20060243958
2006-11-02

Microelectronic package interconnect and method of fabrication thereof

 #271
20060235137
2006-10-19

Die attach adhesives with improved stress performance

 #272
20060226525
2006-10-12

Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same

 #273
20060214274
2006-09-28

Semiconductor device and manufacturing method thereof

 #274
20060205112
2006-09-14

Semiconductor package fabrication

 #275
20060204749
2006-09-14

Wafer-processing tape

 #276
20060180804
2006-08-17

Thin-film semiconductor component and production method for said component

 #277
20060163719
2006-07-27

Semiconductor device and method of manufacturing a semiconductor device

 #278
20060151889
2006-07-13

Semiconductor apparatus and manufacturing method

 #279
20060138617
2006-06-29

Semiconductor integrated circuit device and method of manufacturing the same

 #280
20060138532
2006-06-29

Semiconductor device and manufacturing method of the same

 #281
20060097409
2006-05-11

Semiconductor device

 #282
20060073624
2006-04-06

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

 #283
20060061974
2006-03-23

Solder foil, semiconductor device and electronic device

 #284
20060057779
2006-03-16

Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device

 #285
20060049532
2006-03-09

Chip module

 #286
20060038304
2006-02-23

Conductive adhesive agent with ultrafine particles

 #287
20060033213
2006-02-16

Multilayered anisotropic conductive adhesive for fine pitch

 #288
20060001023
2006-01-05

Method of manufacturing active matrix substrate with height control member

 #289
20050288457
2005-12-29

Co-curable compositions

 #290
20050287952
2005-12-29

Heat sink formed of multiple metal layers on backside of integrated circuit die

 #291
20050269692
2005-12-08

Stacked semiconductor package having adhesive/spacer structure and insulation

 #292
20050269676
2005-12-08

Adhesive/spacer island structure for stacking over wire bonded die

 #293
20050258545
2005-11-24

Multiple die package with adhesive/spacer structure and insulated die surface

 #294
20050243229
2005-11-03

Active matrix substrate with height control member

 #295
20050239270
2005-10-27

Method for producing a semiconductor element

 #296
20050233568
2005-10-20

Method for manufacturing semiconductor device having solder layer

 #297
20050228097
2005-10-13

Thermally conductive compositions and methods of making thereof

 #298
20050224978
2005-10-13

Heat curable adhesive composition, article, semiconductor apparatus and method

 #299
20050218517
2005-10-06

Semiconductor flip-chip package and method for the fabrication thereof

 #300
20050214968
2005-09-29

Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof