209909 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector; Coating Plural coating layers
SOLDER THERMAL INTERFACE CORE ATTACHED WITH LOW-TEMPERATURE SOLDER PASTE FOR MICROELECTRONIC DEVICES
#2SEMICONDUCTOR MODULE
#3Semiconductor module
#4Semiconductor module
#5Semiconductor module
#6METHOD OF FORMING CONFINED GROWTH S/D CONTACT WITH SELECTIVE DEPOSITION OF INNER SPACER FOR CFET
#7SEMICONDUCTOR MODULE
#8Bonded assembly containing different size opposing bonding pads and methods of forming the same
#9METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METHOD FOR JOINING MEMBERS TO BE JOINED
#10Power electronic assemblies with solder layer and exterior coating, and methods of forming the same
#11Semiconductor device, mechanical quantity measuring device, and semiconductor device fabricating method
#12Method of double patterning lithography process using plurality of mandrels for integrated circuit applications