209923 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors prior to the connecting process of a plurality of layer connectors; Function Layer connectors having different functions
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#2SUBSTRATE INTEGRATED WITH PASSIVE DEVICE, AND PRODUCTION METHOD THEREFOR
#3Semiconductor device and manufacturing method thereof
#4Connection arrangement of an electric and/or electronic component
#5Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip