209944 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors Structure
Sub-classes:SEMICONDUCTOR DEVICE
#2SEMICONDUCTOR DEVICE
#3Scalable package architecture and associated techniques and configurations
#4Scalable package architecture and associated techniques and configurations
#5Die attachment for packaged semiconductor device
#6Scalable package architecture and associated techniques and configurations
#7Die attachment for packaged semiconductor device