H01L2224/331 - CPC Classification Index

ClassID:

209948 ⎘

H01L2224/331 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors Disposition

Sub-classes:

H01L2224/33104 » relative to the bonding areas, e.g. bond pads 10
H01L2224/3312 » Layout 1
H01L2224/3318 » being disposed on at least two different sides of the body, e.g. dual array 2

Recent Application in this class:

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