209955 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors; Function Layer connectors having different functions
SEMICONDUCTOR DEVICE
#2INTEGRATED PASSIVE DEVICE WITH VIA FORMED IN ISOLATION TRENCH
#3Chip Module, Use of Chip Module, Test Arrangement and Test Method
#4Semiconductor integrated circuit device
#5Semiconductor integrated circuit device