H01L2224/34 - CPC Classification Index

ClassID:

209956 ⎘

H01L2224/34 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto

Sub-classes:

H01L2224/35 » Manufacturing methods 2
H01L2224/36 » Structure, shape, material or disposition of the strap connectors prior to the connecting process 4
H01L2224/39 » Structure, shape, material or disposition of the strap connectors after the connecting process 0

Recent Application in this class:

20190348333

Semiconductor device with integrated shunt resistor

20190198424

POWER MODULE WITH BUILT-IN POWER DEVICE AND DOUBLE-SIDED HEAT DISSIPATION AND MANUFACTURING METHOD THEREOF

20170309556

Electronic part mounting heat-dissipating substrate

20110053420

Electrical connector

20070217467

Laser diode package utilizing a laser diode stack