H01L2224/35 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto Manufacturing methods

• H01L2224/35001 » Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate 1
• H01L2224/351 » Pre-treatment of the preform connector 1
• H01L2224/352 » Mechanical processes 22
• H01L2224/355 » Modification of a pre-existing material 1
• H01L2224/357 » Involving monitoring, e.g. feedback loop 0
• H01L2224/358 » Post-treatment of the connector 1
• H01L2224/35985 » Methods of manufacturing strap connectors involving a specific sequence of method steps 2

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