209999 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Structure, shape, material or disposition of the strap connectors prior to the connecting process of a plurality of strap connectors
PACKAGE STRUCTURE
#2POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER
#3HEMT PACKAGE WITH BOND WIRE-FREE CONNECTIONS
#4SANDWICH PACKAGE FOR MICROELECTRONICS
#5SEMICONDUCTOR DEVICE
#6Semiconductor device
#7Semiconductor device and method of forming leadframe with clip bond for electrical interconnect
#8Electronic module
#9Double side heat dissipation for silicon chip package
#10METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE USING GANGED CONDUCTIVE CONNECTIVE ASSEMBLY AND STRUCTURE
#11Multi-clip structure for die bonding
#12Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure
#13Power transistor partial current sensing for high precision applications
#14Monolithic power converter package
#15Semiconductor die package and method for making the same
#16SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#17Semiconductor die package including low stress configuration
#18Wirebond-less semiconductor package
#19WAFER LEVEL SEMICONDUCTOR DEVICE CONNECTOR
#20Tie-bar configuration for leadframe type carrier strips
#21Semiconductor die package and method for making the same
#22Semiconductor die package including low stress configuration
#23STACKED DIE MOLDED LEADLESS PACKAGE
#24Semiconductor package with stacked dice for a buck converter
#25WIREBOND-LESS SEMICONDUCTOR PACKAGE
#26Surface-mounting semiconductor device and method of making the same