210028 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Structure, shape, material or disposition of the strap connectors after the connecting process of a plurality of strap connectors; Disposition Layout
SANDWICH PACKAGE FOR MICROELECTRONICS
#2ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
#3Semiconductor device
#4Semiconductor module
#5Semiconductor module
#6Semiconductor module
#7Semiconductor device
#8Semiconductor module and method for manufacturing the same