210029 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Structure, shape, material or disposition of the strap connectors after the connecting process of a plurality of strap connectors; Disposition being disposed on at least two different sides of the body, e.g. dual array
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
#2POWER MODULE USING ELECTRICAL INSULATION FILM TO CONDUCT HEAT
#3SEMICONDUCTOR PACKAGES WITH CHIP STACK
#4CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, AND ELECTRONIC DEVICE
#5Semiconductor packages with vertical passive components
#6Semiconductor device and method of forming leadframe with clip bond for electrical interconnect
#7Semiconductor package with solder standoff
#8Semiconductor package with solder standoff
#9GANG CLIP
#10Integrated circuit package with conductive clips
#11Stackable power module
#12Method for fabricating stack die package
#13Arrangement of multiple power semiconductor chips and method of manufacturing the same
#14Packaging solutions for devices and systems comprising lateral GaN power transistors
#15Electric power semiconductor device
#16Semiconductor package
#17Method for fabricating stack die package
#18Stacked die power converter
#19Measuring current in a power regulator system
#20Flip chip semiconductor device
#21STACKED DIE POWER CONVERTER
#22Combined packaged power semiconductor device