210037 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Manufacturing methods Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
PASSIVATION COATING ON COPPER METAL SURFACE FOR COPPER WIRE BONDING APPLICATION
#2Semiconductor package including stacked semiconductor chips and method for fabricating the same
#3Bonding method
#4Connection pads for low cross-talk vertical wirebonds
#5Electronic device by laser-induced forming and transfer of shaped metallic interconnects
#6Laser-induced forming and transfer of shaped metallic interconnects
#7Packaged semiconductor devices having ribbon wires