210036 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto Manufacturing methods
Sub-classes:V-BONDING USING DOUBLE STACKED STAND-OFF-STITCH FOR IMPROVED RF PERFORMANCE
#2METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING DOUBLE ADHESIVE LAYERS
#3SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#4PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME
#5Semiconductor module with bond wire loop exposed from a molded body and method for fabricating the same
#6Nanostructure barrier for copper wire bonding
#7Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#8Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system
#9Nanostructure barrier for copper wire bonding
#10Bonding wire for semiconductor device
#11Bonding wire for semiconductor device
#12Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#13Semiconductor device and semiconductor device mounting structure having conductor plates
#14Bonding wire for semiconductor device
#15Bonding wire for semiconductor device
#16Bonding wire for semiconductor device
#17Bonding wire for semiconductor devices
#18Method of manufacturing semiconductor device
#19Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system
#20Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#21Methods for forming a sensor array package
#22Coating layer for a conductive structure
#23Method of manufacturing semiconductor device and semiconductor device
#24Bond pad having a trench and method for forming
#25Method for interconnecting die and substrate in an electronic package
#26Methods for forming semiconductor devices with stepped bond pads
#27Aluminum coated copper ribbon
#28Wire structure and semiconductor device having the same, and method of manufacturing the wire structure
#29Methods of forming articles including metal structures having maximized bond adhesion and bond reliability
#30Electronic devices and components for high efficiency power circuits
#31Bonding wire and method for manufacturing same
#32Bonding wire for high-speed signal line
#33Reliable wire method
#34Method and apparatus for manufacturing lead frames
#35Copper or copper alloy, bonding wire, method of producing the copper, method of producing the copper alloy, and method of producing the bonding wire
#36FINE-PITCH FLEXIBLE WIRING
#37Sensor array package
#38Bonding structure of multilayer copper bonding wire
#39Alloy wire and methods for manufacturing the same
#40Semiconductor device and method of manufacturing the same
#41Alloyed 2N copper wires for bonding in microelectronics devices
#42Semiconductor package and manufacturing method thereof
#43Thermal pad shorts test for wire bonded strip testing
#44Method of manufacturing semiconductor device
#45Methods and arrangements relating to semiconductor packages including multi-memory dies
#46Reliable wire structure and method
#47Power module package and method for fabricating the same
#48HIGH STRENGTH AND HIGH ELONGATION RATIO OF AU ALLOY BONDING WIRE
#49SEMICONDUCTOR DEVICE
#503D interconnection structure and method of manufacturing the same
#51Semiconductor device having pad region for wire-bonding and method of manufacturing the semiconductor device
#52Integrated circuit device
#53Semiconductor device and semiconductor device mounting structure
#54Semiconductor device
#55Semiconductor device
#56POLYMER CORE WIRE
#57Chip packaging method and structure thereof
#58Impedance controlled packages with metal sheet or 2-layer RDL
#59Electrical microfilament to circuit interface
#60Method for the miniaturizable contacting of insulated wires
#61ALUMINUM FOR ULTRASONIC BONDING
#62Light emitting device, method for manufacturing the same, and backlight unit
#63Electronic device and manufacturing method of the same
#64Method of manufacturing semiconductor device
#65Electronic devices and components for high efficiency power circuits
#663D interconnection structure and method of manufacturing the same
#67Bonding wire for semiconductor
#68Semiconductor device and method for manufacturing the same
#69Semiconductor device with copper wire having different width portions
#70BONDING WIRE
#71Light-emitting device, planar light source including the light-emitting device, and liquid crystal display device including the planar light source
#72Copper alloy bonding wire for semiconductor device
#73Manufacturing method for composite alloy bonding wire
#74Chip packaging method and structure thereof
#75Processes for IC fabrication
#76Processes and structures for IC fabrication
#77Composite alloy bonding wire and manufacturing method thereof
#78Gold alloy wire for ball bonding
#79HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF SAME
#80Part mounting method
#81Electrical microfilament to circuit interface
#82Tack adhesion testing device
#83Method and system for composite bond wires
#84MANUFACTURING METHOD FOR A SILVER ALLOY BONDING WIRE AND PRODUCTS THEREOF
#85Ultrahigh-Purity Copper and Process for Producing the Same, and Bonding Wire Comprising Ultrahigh-Purity Copper
#86LED linear light source and devices using such source
#87Resin sealed semiconductor device and manufacturing method therefor
#88Gold wire for semiconductor element connection
#89Light-emitting device
#90Semiconductor mounting bonding wire
#91INDIUM-SOLDER-COATED COPPER FOIL RIBBON CONDUCTOR AND METHOD OF CONNECTING THE SAME
#92Bond pad stacks for ESD under pad and active under pad bonding
#93MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES AND METHODS OF FORMING
#94Metallization with tailorable coefficient of thermal expansion
#95ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
#96SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY
#97INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL
#98Light source module, light source apparatus and liquid crystal display
#99Gold wire for connecting semiconductor chip
#100SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#101Wire Bump Material
#102Copper alloy bonding wire for semiconductor device
#103Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
#104Differential signaling system and method of controlling skew between signal lines thereof
#105Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system
#106Semiconductor device
#107Au-Ag based alloy wire for semiconductor package
#108Electrical microfilament to circuit interface
#109Nitride-based semiconductor light-emitting device and method of manufacturing the same
#110Semiconductor device, laminated semiconductor device, and wiring substrate
#111NANO IC
#112Structure and assembly method of integrated circuit package
#113Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board
#114Package for gallium nitride semiconductor devices
#115NANO IC packaging
#116Electronic device and manufacturing method of the same
#117NANO IC packaging
#118Semiconductor device and fabrication method thereof
#119Nitride semiconductor light emitting device
#120Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
#121Semiconductor package capable of absorbing electromagnetic wave
#122Electronic component and method of manufacturing the same
#123Semiconductor light emitting diode and semiconductor light emitting device