210038 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Manufacturing methods Pre-treatment of the preform connector
Sub-classes:PASSIVATION COATING ON COPPER METAL SURFACE FOR COPPER WIRE BONDING APPLICATION
#2Method for Bonding an Electrically Conductive Element to a Bonding Partner
#3Structures for reducing corrosion in wire bonds
#4WIRE BONDING METHOD WITH TWO STEP FREE AIR BALL FORMATION
#5CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS
#6Ag—Au—Pd ternary alloy bonding wire