210043 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Manufacturing methods Modification of a pre-existing material
Sub-classes:Bonding Wire and Method for Manufacturing the Same
#2Method for processing an ultra-high density space interconnect lead under light source guidance
#3Electronic device by laser-induced forming and transfer of shaped metallic interconnects
#4Bonding wire for semiconductor device
#5Laser-induced forming and transfer of shaped metallic interconnects
#6Laser-induced forming and transfer of shaped metallic interconnects
#7Apparatus, system, and method for wireless connection in integrated circuit packages
#8Semiconductor Package with Embedded Die
#9COATED WIRE FOR BONDING APPLICATIONS
#10Semiconductor device and method of forming stud bumps over embedded die
#11Apparatus, system, and method for wireless connection in integrated circuit packages
#12Copper alloy bonding wire for semiconductor
#13Apparatus, system, and method for wireless connection in integrated circuit packages
#14Connecting wire and method for manufacturing same
#15MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCTS THEREOF
#16Semiconductor package with embedded die