H01L2224/438 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Manufacturing methods Post-treatment of the connector

• H01L2224/4381 » Cleaning , e.g. oxide removal step, desmearing 5
• H01L2224/4382 » Applying permanent coating, e.g. in-situ coating 25
• H01L2224/4383 » Reworking 3
• H01L2224/43848 » Thermal treatments, e.g. annealing, controlled cooling 138

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