210061 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Manufacturing methods Methods of manufacturing wire connectors involving a specific sequence of method steps
Sub-classes:PASSIVATION COATING ON COPPER METAL SURFACE FOR COPPER WIRE BONDING APPLICATION
#2METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BONDING TOOLS
#3MOLDED POWER DIE PACKAGE WITH VERTICAL INTERCONNECT
#4SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
#5Methods of forming wire interconnect structures and related wire bonding tools
#6METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED BY THE SAME
#7Semiconductor package structure and packaging method thereof
#8Semiconductor package structure and packaging method thereof
#9Methods of forming wire interconnect structures and related wire bonding tools
#10SYSTEMS AND METHODS FOR HIERARCHICAL EXPOSURE OF AN INTEGRATED CIRCUIT HAVING MULTIPLE INTERCONNECTED DIE
#11Systems and methods for hierarchical exposure of an integrated circuit having multiple interconnected die
#12COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER
#13Method for manufacturing stretchable wire and method for manufacturing stretchable integrated circuit
#14Semiconductor device and its manufacturing method
#15Apparatus, system, and method for wireless connection in integrated circuit packages
#16Off substrate kinking of bond wire
#17Wire bonding device and method of eliminating defective bonding wire
#18Semiconductor device and its manufacturing method
#19Wire bonding method employing two scrub settings
#20Severing bond wire by kinking and twisting
#21Off substrate kinking of bond wire
#22Interconnect wires including relatively low resistivity cores
#23Method for producing a semiconductor module
#24Apparatus, system, and method for wireless connection in integrated circuit packages
#25Apparatus, system, and method for wireless connection in integrated circuit packages
#26Aluminum-based alloy conductive wire used in semiconductor package and manufacturing method thereof