Transfer mold semiconductor packaging processes

Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same

Transparent small memory card

Method for producing an adhesive bond and adhesive bond between a chip and a planar surface

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor package having ultra-thin thickness and method of manufacturing the same

Chip package structure

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

FBGA arrangement

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Integrated circuit package having a resistant layer for stopping flowed glue

Lead frame and method for fabricating semiconductor package employing the same

Lead frame and semiconductor device having the same as well as method of resin-molding the same

Bumped chip carrier package using lead frame and method for manufacturing the same

Lead frame and semiconductor package with the same

Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof

High-frequency signal transmitting device

Structure and method of making capped chips having vertical interconnects

Radio frequency power amplifier module

Method of forming an electrical contact

Semiconductor package, method for manufacturing the same and lead frame for use in the same

BGA package with component protection on bottom

Multi-surface contact IC packaging structures and assemblies

Interconnection element for BGA housings and method for producing the same

ASIC-embedded switchable antenna arrays

Multi-chip module

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device, electronic card and pad rearrangement substrate

Power semiconductor device and power semiconductor module

Modular power semiconductor module

Chip package and substrate

Plastic package and method of fabricating the same

Semiconductor package capable of absorbing electromagnetic wave

Semiconductor device and method of fabricating the same

IC package with stacked sheet metal substrate

Thin film light emitting diode

Semiconductor device and wire bonding method

Circuit device

Use of a down-bond as a controlled inductor in integrated circuit applications

Circuit device

Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load

Circuit arrangement having a load transistor and a voltage limiting circuit and method for driving a load transistor

Electronic component and panel and method for producing the same

Method for reduced input output area

RF circuit electrostatic discharge protection

Ball grid array package and method thereof

Cavity-down semiconductor package with heat spreader

Back-face and edge interconnects for lidded package

Electromagnetic noise shielding in semiconductor packages using caged interconnect structures

Microelectronic component and assembly having leads with offset portions

Chip package structure and process for fabricating the same

Chip scale package and method of fabricating the same

Method for fabricating a semiconductor package with multi layered leadframe

Device for processing a wire

Radio frequency unit analog level detector and feedback control system

System and method for reducing or eliminating semiconductor device wire sweep

Structure and method of making capped chips using sacrificial layer

Thermally enhanced packaging structure and fabrication method thereof

RF amplifier

Resin-sealed semiconductor device

High-speed signaling interface and method for communicating across across an interface

Prevention of contamination on bonding pads of wafer during SMT

Semiconductor device and method of enveloping an integrated circuit

Integrated circuit with copper interconnect and top level bonding/interconnect layer

Integrated circuit package with integral leadframe convector and method therefor

Simplified stacked chip assemblies

Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Chip package and electrical connection structure between chip and substrate

Printed circuit board assembly and method

Module integration integrated circuits

Optimization of routing layers and board space requirements for a ball grid array package

Method for producing a multichip module and multichip module

Optimization of routing layers and board space requirements for a ball grid array land pattern

Vertically stacked pre-packaged integrated circuit chips

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

High power light emitting diode device

Small memory card

Integrated circuit package with laminated power cell having coplanar electrode

Package type semiconductor device

Leadframe for use in a semiconductor package

Semiconductor component with electromagnetic shielding device

Ball grid array package with patterned stiffener surface and method of assembling the same

Bonding tool with polymer coating

Inter-chip and intra-chip wireless communications systems

Method of making circuitized substrate

Metallic dam and method of forming therefor

Process for producing resin-sealed type electronic device

Integrated circuit incorporating flip chip and wire bonding

Wafer level package for micro device

Overmolded optical package

Leadless semiconductor package

Input/output structure and integrated circuit using the same

Encapsulated light receiving and processing semiconductor module with enhanced shielding and grounding properties

Transistor having multiple gate pads

Method of mounting wafer on printed wiring substrate

Thin film circuit board device and method for manufacturing the same

Method of producing an electronic component and a panel with a plurality of electronic components

Semiconductor apparatus and method of fabricating the same

Apparatus for connecting an IC terminal to a reference potential

Spacerless die stacking

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another

Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit

Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate

Fine pitch electronic flame-off wand electrode

Circuit carrier and production thereof

Semiconductor package

Bridge connection type of chip package and fabricating method thereof

Single chip and stack-type chip semiconductor package and method of manufacturing the same

Semiconductor package

Electronic package having a folded flexible substrate and method of manufacturing the same

Reinforced die pad support structure

Receptacle for a programmable, electronic processing device

Light emitting apparatus

Wire bonding method and apparatus

Method for the lateral contacting of a semiconductor chip

Moisture-resistant electronic device package and methods of assembly

Semiconductor device capable of detecting an open bonding wire using weak current

Signal isolators using micro-transformers

Super-thin high speed flip chip package

Semiconductor apparatus with decoupling capacitor

Lead frame with flag support structure

Method of encapsulating interconnecting units in packaged microelectronic devices

Lead frame

Semiconductor package with through-hole

Stress sensitive microchip with premolded-type package

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same

Method for forming ball pads of BGA substrate

Semiconductor device and manufacturing method of semiconductor device

Thin semiconductor package having stackable lead frame and method of manufacturing the same

Memory card

Integrated circuit, interface circuit used in the integrated circuit, and apparatus using the integrated circuit

Bonding pad design for impedance matching improvement

BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same

Multiple cavity/compartment package

Stacked chip package having upper chip provided with trenches and method of manufacturing the same

Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods

Semiconductor device having transferred integrated circuit

Semiconductor package and method of manufacturing the same

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

Copper paste and wiring board using the same

Radiation shielded semiconductor package

Electrical contact and connector and method of manufacture

Method for fabricating thermally enhanced semiconductor device

Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus

Substrate frame

Semiconductor device with staggered electrodes and increased wiring width

Flip-chip package

Semiconductor device, semiconductor module and method of manufacturing semiconductor device

Semiconductor device with pipe for passing refrigerant liquid

Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same

Method of fabricating a two die semiconductor assembly

Stacked-chip semiconductor package and fabrication method thereof

Chip stack package and manufacturing method thereof

High-frequency chip packages

Invertible microfeature device packages

Integrated circuit package having inductance loop formed from a bridge interconnect

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Integrated circuit package having an inductance loop formed from a multi-loop configuration

Stacked microfeature devices and associated methods

Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations

Active area bonding compatible high current structures

Information media using information of defect in an article

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Ball grid array package, stacked semiconductor package and method for manufacturing the same

Coolant cooled type semiconductor device

Area array type package stack and manufacturing method thereof

Semiconductor component having dummy segments with trapped corner air

Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance

Singulation method used in leadless packaging process

Method for manufacturing high-frequency module device

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

Electrochemical cell and fabrication method of the same

Electronic component and method for manufacturing the same

Semiconductor package using flexible film and method of manufacturing the same

Multiple stacked-chip packaging structure

Chip package structure

Heat releasing member, package for accommodating semiconductor element and semiconductor device

Power semiconductor module with deflection-resistant base plate

Stacked chip assembly with encapsulant layer

Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting

Semiconductor device having a light emitting element

Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads

Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials

Cooler for cooling electric part

High frequency circuit module

Semiconductor device

Semiconductor device and wire bonding apparatus

Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks

Multi-chip module

Integrated circuit package with overlapping bond fingers

Semiconductor device and an electronic device

Semiconductor device and method of manufacturing thereof

Leadframe and semiconductor package made using the leadframe

Semiconductor module and DC-DC converter

Molded ball grid array

Semiconductor die packages with recessed interconnecting structures

Semiconductor device and method of manufacturing the same

Wire bonders and methods of wire-bonding

Method for checking the quality of a wedge bond

Fabrication of stacked microelectronic devices

Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads

Fabrication of stacked microelectronic devices

Ultrathin leadframe BGA circuit package

Packaged microelectronic components

Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

Low-inductance circuit arrangement for power semiconductor modules

Voltage protection device

Electronic component protected against electrostatic discharges

Millimeter wave (MMW) radio frequency transceiver module and method of forming same

High frequency circuit using high output amplifier cell block and low output amplifier cell block

High reliability chip scale package

Multi-chips module package and manufacturing method thereof

Semiconductor chip package and stacked module having a functional part and packaging part arranged on a common plane

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Packaged microelectronic devices and methods of forming same

Multi media card formed by transfer molding

Electronic device package

Standoffs for centralizing internals in packaging process

Printed wiring board and manufacturing method therefor

Apparatus used to package multimedia card by transfer molding

Method and apparatus for attaching microelectronic substrates and support members

Method for making electronic devices including silicon and LTCC and devices produced thereby

Multiple substrate microelectronic devices and methods of manufacture

Computer system including at least one stress balanced semiconductor package

Memory package

Semiconductor component having conductors with wire bondable metalization layers

Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Semiconductor device voltage supply for a system with at least two, especially stacked, semiconductor devices

Method of stacking semiconductor element in a semiconductor device

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Method for forming a chip package

Process for fabricating a semiconductor package and semiconductor package with leadframe

Methods for enclosing a thermoplastic package

Method for optimizing routing layers and board space requirements for a ball grid array land pattern

Semiconductor assembly encapsulation mold and method for forming same

Chip package structure

Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module

Semiconductor unit with cooling system

Enhanced die-down ball grid array and method for making the same

Multiple die stack apparatus employing T-shaped interposer elements

Electronic package having a folded package substrate

Cutting method and method of manufacturing semiconductor device

Hybrid integrated circuit

Modular power semiconductor module

Integrated circuit package with a balanced-part structure

Lead for integrated circuit package

Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Semiconductor packaging structure

Semiconductor device including a potential drawing portion formed at a corner

Semiconductor device having a flip-chip construction

Flange for integrated circuit package

Thermoplastic material

Method for shielding integrated circuit devices

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device

Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

Interlayer dielectric and pre-applied die attach adhesive materials

Substrate-less microelectronic package

Method for packaging electronic modules and multiple chip packaging

In-line apparatus and method for manufacturing double-sided stacked multi-chip packages

Substrate-based chip package

Selective consolidation processes for electrically connecting contacts of semiconductor device components

Semiconductor package containing an integrated-circuit chip supported by electrical connection leads

Surface mount multichip devices

Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each other

Circuit board with built-in electronic component and method for manufacturing the same

Method for opening the plastic housing of an electronic module

Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages

Semiconductor device and method of manufacturing the device

Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards

Dual chips stacked packaging structure

Chip package with grease heat sink

Integrated circuit carrier

Chip scale package and method of fabricating the same

Semiconductor device, electronic device, electronic equipment, and method of manufacturing semiconductor device

Substrate for semiconductor package and wire bonding method using thereof

Ultra wideband BGA

Adhesion enhanced semiconductor die for mold compound packaging

Metal carrier (leadframe) for receiving and contact-connecting electrical and/or optoelectronic components