Chip package structure and chip packaging process

Thermal dissipation in integrated circuit systems

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Method for maintaining solder thickness in flipchip attach packaging processes

CHIP PACKAGE STRUCTURE

Thermally enhanced component interposer: finger and net structures

System for reducing or eliminating semiconductor device wire sweep

Chip fixed structure

Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device

Power semiconductor switching-device and semiconductor power module using the device

Integrated circuit with intergrated capacitor and methods for making same

Method of making chip package with grease heat sink

Carrier substrates and conductive elements thereof

Wire bonding apparatus

Circuit support for a semiconductor chip and component

Semiconductor device assemblies and packages including multiple semiconductor device components

Die down semiconductor package

Method for manufacturing leadless semiconductor packages

Through electrode, spacer provided with the through electrode, and method of manufacturing the same

Microelectronic assembly having encapsulated wire bonding leads

Interposer including adhesive tape

Semiconductor device of a charge storage type

Semiconductor BGA package having a segmented voltage plane and method of making

Power semiconductor module

Light emitting element

Circuit board for connecting an integrated circuit to a support and IC BGA package using same

Low fabrication cost, high performance, high reliability chip scale package

Circuit device and manufacturing method thereof

Land grid array packaged device and method of forming same

Lower profile flexible substrate package for electronic components

Programmable radio transceiver

Semiconductor device package having a semiconductor element with resin

Multichip semiconductor package

Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Circuit device

Semiconductor chip package

Multilayer integrated circuit for RF communication and method for assembly thereof

Semiconductor device designed to produce no resonance of loop due to ultrasonic vibration, semiconductor design apparatus and method of manufacturing semiconductor device

Lead on chip semiconductor package

Surface-mountable semiconductor component and method for producing it

Charge device model (CDM) electrostatic discharge (ESD) failure rate via capacitive coating

Integrated circuit module package and assembly method thereof

Solid state imaging device having electromagnetic wave absorber attached to a mounting board

Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module

Electronic component housing package and electronic apparatus

Chip module

Stress and force management techniques for a semiconductor die

Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier

Die package with higher useable die contact pad area

Stacked electronic part

Semiconductor package having step type die and method for manufacturing the same

Board-on-chip packages

Package with stacked substrates

Thin-film semiconductor device and method of manufacturing the same

Manufacturing and testing of electrostatic discharge protection circuits

Semiconductor package

Semiconductor package having heat spreader and package stack using the same

Leadframe with die pad

Transmitting optical subassembly capable of monitoring the front beam of the semiconductor laser diode

High frequency module board device

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

Circuit component with bump formed over chip

Bonding pad structure, display panel and bonding pad array structure using the same and manufacturing method thereof

Semiconductor package free of substrate and fabrication method thereof

Semiconductor package free of substrate and fabrication method thereof

Semiconductor package free of substrate and fabrication method thereof

Bonding pad arrangement method for semiconductor devices

Testable electrostatic discharge protection circuits

Infrared receiver chip

Bump bonding apparatus and bump bonding method

Semiconductor packaging techniques for use with non-ceramic packages

Via structure of packages for high frequency semiconductor devices

Semiconductor package free of substrate and fabrication method thereof

Low fabrication cost, high performance, high reliability chip scale package

LSI package, LSI element testing method, and semiconductor device manufacturing method

Packaged die on PCB with heat sink encapsulant and methods

Semiconductor package

Interconnect system without through-holes

Semiconductor device

Packaging substrates for integrated circuits and soldering methods

Chip package structure

Multiple die package

Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods

Actuator and bonding apparatus

Semiconductor package for lowering electromagnetic interference and method for fabricating the same

Semiconductor integrated circuit device

Packaged systems with MRAM

Daisy chaining of serial I/O interface on stacking devices

Optimized power delivery to high speed, high pin-count devices

Semiconductor device and a memory system including a plurality of IC chips in a common package

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Electronic device configured as a multichip module, leadframe and panel with leadframe positions

Semiconductor package free of substrate and fabrication method thereof

Two die semiconductor assembly and system including same

Lead frame and method for manufacturing semiconductor package with the same

High density lead arrangement package structure

Lead frame for semiconductor package and method of fabricating semiconductor package

Wire bonding method and apparatus

Wire bonding apparatus

Bonding arm swinging type bonding apparatus

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask

Microelectronic packages and methods therefor

SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

Method of producing a digital fingerprint sensor and the corresponding sensor

Semiconductor device with capacitor

Thermally enhanced metal capped BGA package

Method of forming a leadframe for a semiconductor package

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles

Method of manufacturing hybrid integrated circuit device

Chip-on-board module, and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Microelectronic assembly having array including passive elements and interconnects

Connector assembly

Semiconductor package with wire bonded stacked dice and multi-layer metal bumps

Method for assembling a ball grid array package with two substrates

Semiconductor package and method for manufacturing the same

Semiconductor package with passive device integration

Trench-gate semiconductor devices

System and method for automated wire bonding

Compliant wirebond pedestal

Module with a built-in component, and electronic device with the same

Semiconductor part for component mounting, mounting structure and mounting method

Flip-chip adaptor package for bare die

Method and apparatus for high electrical and thermal performance ball grid array package

Microelectronic adaptors, assemblies and methods

Circuit carrier and package structure thereof

Method of making microelectronic packages including electrically and/or thermally conductive element

Adaptable electronic storage apparatus

Semiconductor device and method of manufacturing same

Integrated circuit package with transparent encapsulant and method for making thereof

Surface mountable hermetically sealed package

METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION

Bonding method, bonding apparatus and bonding program

Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program

Semiconductor integrated circuit having connection pads over active elements

WAFER-LEVEL PACKAGE STRUCTURE

Semiconductor device

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Junction member comprising junction pads arranged in matrix and multichip package using same

Hermetic surface mounted power package

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME

Wafer level hermetic sealing method

System for reducing oxidation of electronic devices

Hermetic passivation structure with low capacitance

Masking layer in substrate cavity

Optical data link and method of manufacturing optical data link

Semiconductor apparatus

Electronic component package

Semiconductor integrated circuit device

Microelectronic component assemblies and microelectronic component lead frame structures

Routing element for use in semiconductor device assemblies

Microelectronic component assemblies and microelectronic component lead frame structures

Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods

Concealable chip leadframe unit structure

Semiconductor chip leadframe module

Semiconductor device

Semiconductor device using LED chip

Methods of making microelectronic assemblies

Methods and apparatus to reduce growth formations on plated conductive leads

Carrier, method of manufacturing a carrier and an electronic device

Semiconductor integrated circuit device

Stacked IC device having functions for selecting and counting IC chips

Semiconductor device and manufacturing method for the same

Fabrication process for a semiconductor integrated circuit device

Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier

Semiconductor chip heat transfer

Semiconductor device

Three-level leadframe for no-lead packages

Electronic device having wiring substrate and lead frame

Semiconductor chip and manufacturing method for the same, and semiconductor device

Alignment and orientation features for a semiconductor package

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

High frequency module

Insulating substrate for IC packages having integral ESD protection

High-frequency module, and method of producing same

Micro lead frame package having transparent encapsulant

Semiconductor chip with external connecting terminal

Semiconductor chip with external connecting terminal

Semiconductor device and semiconductor module

Semiconductor chip with external connecting terminal

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Multi-chip module and methods

Semiconductor device

Surface mount package

Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area

Strobe light control circuit and IGBT device

Method of manufacturing a semiconductor device by using a matrix frame

Method of backside grinding a bumped wafer

Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device

Thin film capacitors on ceramic

Multi-chip package structure

Chip assembly package

Semiconductor chip package and multichip package

Multi-chip package structure

System and method for improving solder joint reliability in an integrated circuit package

Chemical leadframe roughening process and resulting leadframe and integrated circuit package

Package structure for semiconductor

Method to remove fluorine residue from bond pads

Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same

Attachment of integrated circuit structures and other substrates to substrates with vias

Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Process for producing optical semiconductor device

Warpage control of array packaging

Integrating passive components on spacer in stacked dies

Chip packaging compositions, packages and systems made therewith, and methods of making same

Adhesive film for manufacturing semiconductor device

Embedded redistribution interposer for footprint compatible chip package conversion

Semiconductor module with a semiconductor stack, and methods for its production

Packaging substrates for integrated circuits and soldering methods

Tapered dielectric and conductor structures and applications thereof

Multiple chip package module having inverted package stacked over die

System and method for increasing the number of IO-s on a ball grid pattern

Stress distribution package

Wire bonding package

Dual semiconductor die package with reverse lead form

Stack package with improved heat radiation and module having the stack package mounted thereon

Substrate structure capable of reducing package singular stress

Semiconductor component arrangement with an insulating layer having nanoparticles

Nitride semiconductor light emitting device

Optical apparatus and image production apparatus

Method and apparatus for trace shielding and routing on a substrate

Method for making a package substrate without etching metal layer on side walls of die-cavity

Castellation wafer level packaging of integrated circuit chips

Shielding arrangement to protect a circuit from stray magnetic fields

Power module with heat exchange

Semiconductor component and method for fabricating

Inverted J-lead for power devices

Method for ball grid array chip packages having improved testing and stacking characteristics

Structure and method for reinforcing a bond pad on a chip

Semiconductor device

Method of making semiconductor device

Copper-based chip attach for chip-scale semiconductor packages

Semiconductor package

Semiconductor package with improved solder joint reliability

Method for manufacturing thin GaAs die with copper-back metal structures

Microelectronic devices and methods for filling vias in microelectronic devices

Semiconductor device and fabrication method thereof

Bonding apparatus and bonding external appearance inspection device

Semiconductor device and method of manufacturing thereof

Information storage apparatus and electronic device in which information storage apparatus is installed

Semiconductor device

Arrangement of a chip package constructed on a substrate and substrate for production of the same

Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method

Lead-free integrated circuit package structure

Stackable integrated circuit packaging

Semiconductor package with a chip on a support plate

Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same

Chip package and electrical connection structure between chip and substrate

Protective device

Resonator device, electronic equipment provided with resonator device and method of manufacturing resonator device

Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification

Circuit layout structure

Packages for image sensitive electronic devices

Semiconductor package with heat spreader

Stacked chip semiconductor device

Switching media for chip carrier device

Circuit module

Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)

Illumination assembly

Chip assembling structure and socket

Parallel design processes for integrated circuits

Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation

Integrating passive components on spacer in stacked dies

Low coefficient of thermal expansion (CTE) semiconductor packaging materials

Semiconductor chip, semiconductor device, circuit board, and electronic instrument

Semiconductor device and method of manufacturing the same, circuit board, and electronic apparatus

Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)

Multi-concentric pad arrangements for integrated circuit pads

Module assembly and method for stacked BGA packages

Highly reliable stack type semiconductor package

Methods and apparatus for integrated circuit device power distribution via internal wire bonds

Method of manufacturing a semiconductor device

Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same

Semiconductor/printed circuit board assembly, and computer system

Techniques for packaging multiple device components

Impedance matching commonly and independently

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Substrate-based package for integrated circuits

Electric connection terminal and method of manufacturing the same, semiconductor device and method of mounting the same

Mounting structure for semiconductor parts and semiconductor device

Semiconductor chip package having decoupling capacitor and manufacturing method thereof

Encapsulated lead having step configuration

Heat spreader and semiconductor device package having the same

Chip package structure and manufacturing method thereof

Semiconductor device

Semiconductor chip package and method

Stacked BGA packages

Wafer level stack structure for system-in-package and method thereof

Integrated circuit carrier apparatus method and system

Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices having conductive complementary structures

Molded leadless package having a partially exposed lead frame pad

EMI shielded integrated circuit packaging apparatus method and system

Semiconductor component and sensor component for data transmission devices

Semiconductor integrated circuit

Compliant interconnect assembly

Etching method and method of manufacturing circuit device using the same

Integrated circuit device and the manufacturing method thereof