210104 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector; Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on the semiconductor or solid-state body to be connected
INTEGRATED CIRCUIT PACKAGE
#2SEMICONDUCTOR EQUIPMENT
#3Semiconductor package and manufacturing method thereof
#4Printed circuit board structure having pads and conductive wire
#5Semiconductor module and method for manufacturing the same
#6Electrode connection structure and electrode connection method
#7Method for fabricating chip elements provided with wire insertion grooves